Electronic component gluing device

Abstract

The invention discloses an electronic component gluing device. A device body is included and internally provided with a gluing mechanism, a pressing mechanism and a pedaling mechanism. The gluing mechanism comprises a gluing barrel, an extrusion ball valve and a piston connected with the extrusion ball valve through an extrusion shaft. The pressing mechanism comprises a pressing wedge block, a push shaft, a pushing ball valve, a connecting shaft fixedly arranged on the push shaft, and a sliding rod which is in sliding connection with the connecting shaft. The pedaling mechanism comprises a pedal plate, a pull ring, an elastic shaft, an L-shaped downward sliding rod fixedly connected with the pull ring, a downward sliding wedge block arranged on the top of the L-shaped downward sliding rod,and an elastic piece elastically connected with the downward sliding wedge block, wherein the pull ring and the elastic shaft are arranged on the upper side and the lower side of the pedal plate. Through the gluing mechanism, the pressing mechanism and the pedaling mechanism arranged in the device body, the hands and the feet of operators can act at the same time, the gluing work can be finishedwithout cooperation of multiple people, the operation efficiency is improved, and the enterprise production cost is reduced.

Description

technical field [0001] The invention relates to the field of gluing for electronic components, in particular to a gluing device for electronic components. Background technique [0002] Electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments, such as capacitors and transistors. The general term for sub-devices such as hairsprings, hairsprings, etc., common ones include diodes, etc. In the process of producing electronic components, it is necessary to apply glue on the surface of electronic components to meet the corresponding production process requirements, but the existing glue is applied manually. In this process, not only manual fixing is required For electronic components, it is necessary to manually squeeze the glue for glue application. W...

AI Technical Summary

Problems solved by technology

In the production process of electronic components, it is necessary to apply glue on the surface of electronic components to meet the corresponding production process requirements, but the existing glue is applied manually. In this process, not only manual fixing is required For electronic components, it is necessary to manually squeeze the glue for gluing. When encountering larger electronic components, it often requires the cooperation of multiple people. This not only increases the cost of manual operation of the enterprise, but also reduces the efficiency of gluing. A glue coating device for electronic components

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