The utility model provides a kind of guiding alignment mechanism, is installed on jacking mechanism, guiding alignment mechanism includes the guiding alignment component for
semiconductor substrate guiding alignment and the
power component of driving guiding alignment component up and down movement, wherein,
power component drives dynamic guiding alignment component and rises from first height position to second height position, so that guiding alignment component in second height position will mechanical hand transfer
semiconductor substrate guiding and positioning in the placement position of jacking mechanism;
Power component drives guiding alignment component to drop from second height position to first height position along with placement position, in the process of descending,
semiconductor substrate is guided to glue position on platform, and the first height position is lower than the height of glue spreading of
coating knife along horizontal direction, to facilitate
coating knife accurately glue spreading on fixed semiconductor substrate.The utility model further provides a kind of glue spreading
system with the above guiding alignment mechanism.