The invention discloses a device and a method for implementing local
electroplating of parts. The device comprises a
copper bottom plate, a
copper cover plate, a conductive bar, screws, leads and a
metal plate; when a
blind hole part is locally electroplated, the non-
electroplating part of the part is put into a groove of the
copper bottom plate, then the copper cover plate is pressed on the
metal plate, and the to-be-electroplated part of the part is naked outside the copper cover plate; when the local surface of a non
blind hole part is electroplated, the non-
electroplating part of the part is put into the groove of the copper bottom plate, and the to-be-electroplated surface is naked outside. The method comprises the following steps of:
processing the copper bottom plate and the copper cover plate, chemically removing oil,
coating a layer of vinyl perchloride
hydrogen paint on the lower surface of the copper bottom plate and the upper surface of the copper cover plate respectively, airing the paint
layers, fixing the part to be electroplated on the copper bottom plate, pressing the copper cover plate as required, then vertically hanging the whole
assembly in the center of an electroplating bath, and switching on a power supply. The device has simple structure, is easy to process, accurately positions the plated surface of the part, saves the time and reduces the production cost.