Fitting method

A laminating and compounding technology, which is applied in the bonding method of adhesive heating, adhesives, etc., can solve the problems of poor lamination yield, inability to rework, general production efficiency, etc.

Active Publication Date: 2016-09-21
SUZHOU TONGLI PHOTOELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of this method are: the production efficiency is average, the bonding yield is poor, generally 75% to 90%, and it cannot be reworked. It is only suitable for the bonding of small and medium-sized products, and cannot meet the needs of full bonding of large-sized products.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0066] Embodiment: a kind of pasting method

[0067] See attached Figure 1~3 As shown, a bonding method includes the following steps:

[0068] Step 1: Enclose the surface to be glued on the surface of the first component to be bonded 1 (glass cover) with high temperature resistant adhesive tape 3 to form a closed pasting area 2;

[0069] The second step: apply the glue to the sticking area 2 so that in the sticking area 2, the glue is scraped flat, and the excess glue is scraped onto the high temperature resistant adhesive tape, thus forming a A viscose layer 4 with a uniform thickness, and the thickness of the viscose layer 4 is greater than the thickness of the high temperature resistant adhesive tape 3; the glue is made by mixing the A component and the B component according to the mass ratio of 1:1 Obtain; Described A component is made up of the material of blanking weight part:

[0070] Base material 60 parts by weight;

[0071] Catalyst 0.1 part by weight;

[0072]...

Embodiment 2 8

[0107] Embodiments 2-8: a bonding method

[0108] The bonding steps are the same as in Example 1, the difference is the glue: the glue is prepared by mixing component A and component B according to the mass ratio of 1:1.

[0109] The A group batching table of embodiment two~six is ​​as follows:

[0110]

Binder

catalyst

Accessories

Embodiment two

85 parts by weight

0.2 parts by weight

25 parts by weight

Embodiment Three

95 parts by weight

0.3 parts by weight

15 parts by weight

Embodiment four

90 parts by weight

0.5 parts by weight

20 parts by weight

Embodiment five

67 parts by weight

0.1 parts by weight

5 parts by weight

Embodiment six

85 parts by weight

0.15 parts by weight

30 parts by weight

[0111] The batching table of B group of embodiment two~six is ​​as follows:

[0112]

Embodiment 2

[0114] Embodiment 2: The compound conforming to the general formula (1) and the compound conforming to the general formula (2) are mixed according to the mass ratio of 1:1. In general formula (1), R 1 Represents methyl; R 2 , R 3 , R 4 represents a vinyl group; x=20, y=20; the viscosity of the compound conforming to the general formula (1) is 7000 centipoise; in the general formula (2), a is equal to 20, and b is equal to 30.

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Abstract

The pasting method comprises the following steps: the first step: enclosing the surface of the first part to be pasted with high-temperature-resistant adhesive tape to form a closed pasting area; the second step: applying silicone gel to the pasting area area to form a uniform thickness adhesive layer in the sticking area, and make the thickness of the adhesive layer greater than the thickness of the high temperature resistant tape; the third step: heating the adhesive layer so that the The glue in the adhesive layer is cured to obtain a cured adhesive layer; the fourth step: tearing off the high temperature resistant tape, and then attaching the second part to be bonded to the first part to be bonded. In the present invention, the surface to be glued of the first component to be pasted is surrounded by a high-temperature-resistant adhesive tape to form a closed pasting area to limit the scope of glue application, so that the glue application is accurate and fast.

Description

technical field [0001] The present invention relates to a bonding method, in particular to a full bonding process between a liquid crystal panel or a liquid crystal module and a protective cover, or / and a full bonding process between a protective cover and a touch sensor, or / and a liquid crystal panel Or the full bonding process between the liquid crystal module and the touch sensor. Background technique [0002] Products such as touch screen mobile phones and tablet computers are used more and more widely. The structure of products such as touch-screen mobile phones and tablet computers generally includes a protective cover, a liquid crystal panel (or liquid crystal module) and a touch sensor, and the mutual fixing between them is generally carried out by laminating with a high-transparency adhesive. For example: the publication number is CN102622146, and the Chinese invention patent application titled "A Capacitive Touch Screen and Its Production Method" discloses a capac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J5/06C09J183/07C09J183/05
Inventor 石东
Owner SUZHOU TONGLI PHOTOELECTRIC CO LTD
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