Camera module array and corresponding integral substrate

A camera module and integrated technology, applied in the field of optics, can solve the problems of increased cost and double-camera module size, and achieve the effects of saving costs, reducing overall height, and enhancing structural strength

Pending Publication Date: 2019-04-26
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above solution has the problems of increasing the size of the dual-camera module and increasing the cost.

Method used

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  • Camera module array and corresponding integral substrate
  • Camera module array and corresponding integral substrate
  • Camera module array and corresponding integral substrate

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Embodiment Construction

[0044] For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are descriptions of exemplary embodiments of the application only, and are not intended to limit the scope of the application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0045] It should be noted that in this specification, expressions of first, second, etc. are only used to distinguish one feature from another, and do not represent any limitation on the features. Accordingly, a first body discussed hereinafter may also be referred to as a second body without departing from the teachings of the present application.

[0046] In the drawings, the thickness, size and shape of objects have been slight...

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Abstract

The invention provides an integral substrate, comprising the following parts: a circuit board, having a first region and a second region corresponding to a first lens component and a second lens component; a metal plate, having a first light through hole corresponding to the first lens component, an upper surface suitable for mounting the first and second lens components, and a lower surface contacted with the upper surface of the circuit board; and a molding portion, formed on the lower surface of the circuit board, wherein the integral substrate is provided with a first formation surface suitable for mounting a first photosensitive element and a second formation surface suitable for mounting a second photosensitive element, and the first formation surface and the second formation surfaceare located at different heights. The invention further provides a corresponding camera module array. The invention can increase the structural strength of the substrate of a dual-camera module, andcan save cost by cancelling the metal bracket of the traditional dual-camera module. In addition, the invention further facilitates to reduce radial and axial dimensions of the camera module array.

Description

technical field [0001] The present invention relates to the field of optical technology, and in particular, the present invention relates to a solution of a camera module array and a corresponding integrated substrate. Background technique [0002] With the continuous development of smart devices, the requirements for camera modules are getting higher and higher. For example, in the past two years, the camera of a smart phone has changed from a single camera to a dual camera, and the development of a dual camera module has also become an important trend in the development of mobile phone camera modules. To put it simply, dual cameras can collect images through the cooperation of two cameras, so as to achieve richer image collection functions. The existing dual cameras can be divided into two categories according to their functions: one is to use the dual cameras to generate stereo vision, obtain the depth of field of the image, and use the depth of field information to perf...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H04N5/225G02B7/00G03B17/12G03B17/14G03B30/00
CPCH04M1/0264G02B7/006G03B17/12G03B17/14H04N23/45H04N23/54H04N23/50H04N23/57H04N23/55
Inventor赵波杰方银丽梅哲文陈振宇苏小娟吴业
OwnerNINGBO SUNNY OPOTECH CO LTD