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Method for preparing printed circuit board

A technology for printed circuit boards and circuit boards, which is applied in the directions of printed circuit manufacturing, printed circuits, and the formation of electrical connection of printed components, and can solve problems such as low flatness

Active Publication Date: 2019-04-26
GUANGZHOU FASTPRINT CIRCUIT TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a method for preparing printed circuit boards to solve the problem of low flatness.

Method used

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  • Method for preparing printed circuit board
  • Method for preparing printed circuit board
  • Method for preparing printed circuit board

Examples

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Embodiment Construction

[0025] In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. The preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the present disclosure is provided.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. T...

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Abstract

The invention relates to a method for preparing a printed circuit board, which comprises the following steps: S100, providing a multilayer circuit board; S200, processing a through hole on the multilayer circuit board, and performing hole plating copper and resin hole plugging treatment on the through hole; S300, baking the multilayer circuit board for the first time, curing and shrinking the resin in the through hole to form a depression, and carrying out the first plate grinding treatment on the multilayer circuit board; S400, covering the resin protective layer on the multilayer circuit board, processing an insert hole, and removing resin and glass fiber on the inner wall of the insert hole; S500, carrying out copper deposition treatment on the inner wall of the insert hole; S600, carrying out electroplating treatment on the concave part to ensure that metal protruding out of the concave part is deposited at the concave part; S700, removing the covering resin protective layer, and carrying out the second plate grinding treatment on the multilayer circuit board. The covered resin protective layer can protect the resin in the through hole from being influenced in the process of removing the resin on the inner wall of the insert hole.

Description

technical field [0001] The invention relates to the technical field of circuit board preparation, in particular to a preparation method of a printed circuit board. Background technique [0002] Some aerospace and military products have extremely harsh requirements on the reliability of electronic components compared with ordinary products due to the extreme heat, extreme cold, high voltage and other harsh environments used in their applications, and generally require the production of positive etched printed circuit boards. [0003] When preparing a positive etch back printed circuit board with via holes, the metal layer at the via hole on the positive etch back printed circuit board will be recessed, so that the flatness of the positive etch back printed circuit board is low. SUMMARY OF THE INVENTION [0004] Based on this, it is necessary to solve the problem of low flatness by providing a method for preparing a printed circuit board. [0005] A preparation method of a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K3/00
CPCH05K3/0055H05K3/429H05K2203/1105
Inventor 许龙龙罗畅陈黎阳
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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