Integrated circuit electrostatic discharge bus structure and related method

Abstract

An integrated circuit ESD bus structure includes: a circuit area; a plurality of electrostatic discharge (ESD) buses; a plurality of pad groups adjacent to and connected to the plurality of ESD buses;a common ESD bus; and a plurality of bonding lines configured to connect the plurality of pad groups to the common ESD bus.

Description

technical field [0001] The present invention relates to integrated circuit structures and related methods, and more particularly, to integrated circuit electrostatic discharge bus structures and related methods. Background technique [0002] For an integrated circuit electrostatic discharge (hereinafter abbreviated as ESD) structure 1 as shown in FIG. , wherein the placement of the I / O pad 12 can be adjusted within a certain range. [0003] Typically, filler cells F1 and F2 are typically placed in the empty space between I / O pads 12 and are connected to electrostatic discharge (ESD) bus 11 (e.g., to ground or system voltage Layout traces of the circuit area 10 , which connects each portion of the circuit area 10 and the filler cells F1 and F2 to a continuous ESD bus to provide ESD protection for the integrated circuit ESD bus structure 1 . [0004] However, the portion of circuit area 10 occupied by filler cells F1 and F2 is wasteful for integrated circuit ESD bus structur...

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Problems solved by technology

[0004] However, the portion of circuit area 10 occupied by filler cells F1 and F2 is wasteful for integrated circuit ESD bus structures

Furthermore, under the strict requirement of the integrated circuit ESD bus structure 1 having a rectangular shape, it leads to a lack of flexibility in the layout design of the inner circuit

[0005] Furthermore, when there are circuits with irregular shapes and different areas, the circuit area 10 must be enlarged to contain the circuits with irregular shapes and different areas, which increases production costs

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