Wafer cleaning tank for easy airflow control

Abstract

The invention provides a wafer cleaning tank convenient for air flow control, which includes a cleaning tank body, movable air plates, guide rod mechanisms, fixed air plates, an air intake mechanism, an air guide pipe and a wafer mounting bracket. Air vents are respectively arranged in the upper and lower parts of the two sides of the cleaning tank body. The movable air plates are movably arranged on the upper parts of the two sides of the cleaning tank body, and the guide rod mechanisms are respectively connected with the movable air plates. The fixed air plates are fixedly arranged on the lower parts of the two sides of the cleaning tank body, and ventilation channels are reserved in the lower parts of the two sides of the cleaning tank body. The air intake mechanism is arranged on the top of the cleaning tank body. The air guide pipe is arranged at the bottom of the cleaning tank body. The wafer mounting bracket is arranged at the top of the air guide pipe. By using the wafer cleaning tank convenient for air flow control of the invention, smooth flow of air in the cleaning tank can be ensured no matter whether there is a wafer placed in the cleaning tank, gas retention in the cleaning tank is avoided, the condensation of cleaning liquid or vapor fog in the cleaning tank is avoided, and the cleaning effect of wafers is guaranteed.

Description

Technical field [0001] The invention relates to the technical field of wafer cleaning appliances, in particular to a wafer cleaning tank that is easy to control airflow. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called wafer; it can be processed into various circuit component structures on silicon wafers, and become integrated with specific electrical functions. Circuit products. [0003] The manufacture of integrated circuits is the core of the electronic information industry, and is one of the most important high and new technologies that promote the development of national economy and social informatization. With the development of wafers in the direction of large sizes and fine lines, the requirements for surface flatness of wafers are getting higher and higher. Therefore, chemical mechanical polishing equipment is getting more and more attention in ...

AI Technical Summary

Problems solved by technology

During the use of the existing wafer cleaning tank, when putting or taking out the cleaned wafer in the wafer cleaning tank, the flow direction of the air flow in the tank will be disrupted, resulting in an uncontrolled gas stagnation area in the tank , causing the cleaning liquid or mist in the tank to condense and produce particles, which affect the cleaning effect of the wafer

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