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Heat dissipation structure

A technology of heat dissipation structure and capillary structure, which is applied in the fields of instruments, electrical digital data processing, electrical components, etc., can solve the problems that heat pipes or vapor chambers cannot be used with each other and are inconvenient to use.

Pending Publication Date: 2019-05-03
ASIA VITAL COMPONENTS (CHINA) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since the finished products produced by existing heat pipes or vapor chambers are all fixed in size (such as length), the positions and heights of the heat sources of each electronic device are not the same, so that the installed heat pipes or vapor chambers in each electronic device are not the same. The temperature plate must be selected in a suitable size before it can be used, so that the heat pipes or vapor chambers in each electronic device cannot be used (or continue to be used) with each other, which brings considerable inconvenience in use

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Embodiment Construction

[0025] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

[0026] The present invention is a heat dissipation structure, please refer to figure 1 It is a schematic diagram of a three-dimensional combination of an embodiment of the present invention; Figure 2A It is a schematic diagram of a partial section of an embodiment of the present invention in a state of being compressed and lowered in height; Figure 2B It is a schematic diagram of a partial cross-section of an embodiment of the present invention in a stretched height state. The heat dissipation structure 1 includes a body 10, the body 10 is shown as a uniform temperature plate in this embodiment, but it is not limited thereto, and the body 10 can be selected as a heat plate, heat pipe or other two-phase flow heat dissipation structure. The body 10 has an upper plate 11, a lower...

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Abstract

The invention provides a heat dissipation structure. The structure includes a body; the body is provided with an upper plate, a lower plate, a telescopic portion and a cavity; the upper plate, the telescopic portion and the lower plate together define the cavity; the telescopic portion is disposed between the upper plate and the lower plate; a body capillary structure is disposed in the cavity; the body capillary structure is disposed on an inner wall of the cavity; and a working fluid is filled in the cavity.

Description

technical field [0001] The invention relates to a heat dissipation structure, in particular to a heat dissipation structure capable of stretching and contracting a body to change its length (or height) and bending. Background technique [0002] With the advancement of semiconductor technology, the volume of integrated circuits is gradually shrinking. In order to enable integrated circuits to process more data, integrated circuits with the same volume can already accommodate several times more computing elements than before. , when the number of computing elements in the integrated circuit is increasing, the execution efficiency is getting higher and higher, so the heat energy generated by the computing elements is also increasing. Take the common central processing unit as an example. When the amount is measured, the heat emitted by the central processing unit is enough to burn the entire central processing unit. Therefore, the heat dissipation structure of the integrated ci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/427H01L23/473G06F1/20
Inventor 刘汉敏周小祥
Owner ASIA VITAL COMPONENTS (CHINA) CO LTD