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Microlens having a carrier-free optical interference filter

A technology of interference filters and microlenses, which is applied in the fields of electric solid-state devices, semiconductor devices, and phase-influenced characteristic measurements, and can solve the problems of difficult, time-consuming, and high-cost implementations of external carriers and optical systems

Pending Publication Date: 2019-05-03
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, integrating a separate external carrier with the optical system is difficult, time-consuming, and costly

Method used

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  • Microlens having a carrier-free optical interference filter
  • Microlens having a carrier-free optical interference filter
  • Microlens having a carrier-free optical interference filter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0127] a) Example 1: Interference filter 15 above "bowl-shaped" microlens 13

[0128] Figure 1B : Shape the μ-lens 13a, 13b, 13c into a "bowl", which is filled with a highly refractive (optical dense) material and planarized

[0129] Figure 1C : deposition interference filter 15

Embodiment 2

[0130]b) Example 2: Interference filter 15 above "bowl-shaped" microlenses 13 and cavities 33, 36a, 36b

[0131] Figure 3A : Depositing a sacrificial layer 32 and forming microlenses 13a, 13b, 13c inside said sacrificial layer 32 as "bowls", which are filled and planarized with a highly refractive (optical dense) material

[0132] Figure 3B : (selectively for surrounding material) removal of sacrificial layer 32 and creation of cavities 33, 36a, 36b

[0133] Figure 3C : deposition interference filter 15

Embodiment 3

[0134] c) Example 3: Interference filter 15 above “arched” microlenses 13 a , 13 b , 13 c while retaining additional material layer 42

[0135] Figure 4A : Form microlenses 13a, 13b, 13c from optically dense material

[0136] Figure 4B : Lens gaps are filled with optically thinning material and planarized

[0137] Figure 4C : deposition interference filter 15

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Abstract

An apparatus (10, 12) and a method for producing the apparatus (10, 12) are described, wherein the apparatus (10, 12) includes a substrate (11) with a photodetector (12) and a dielectric (18) arrangedon the substrate (11). Further, the apparatus (10, 12) includes a microlens (13) arranged on a first side (18a) of the dielectric (18). The microlens is configured to steer incident radiation (14) onto the photodetector (12). Moreover, the apparatus (10, 12) includes a carrier-free optical interference filter (15). The microlens (13) is arranged between the photodetector (12) and the interferencefilter (15), and the interference filter (15) has a plane surface (17) on a side (15a) facing away from the photodetector (12).

Description

technical field [0001] The present disclosure relates to a device with a microlens and a carrierless optical interference filter and to a method for manufacturing the device, in particular to the integration of an optical on-chip interference filter of an optical sensor with a microlens. Background technique [0002] Interference filters are currently produced externally on a single carrier, for example a separate glass sheet, and incorporated into the optical system above the optical sensor and the microlens. However, integrating a separate external carrier with the optical system is difficult, time-consuming, and costly to implement. Contents of the invention [0003] Accordingly, it would be desirable to provide improved devices and methods for manufacturing such devices that enable easy and cost-effective integration. [0004] This can be achieved, for example, by means of devices and methods according to the present disclosure. This disclosure describes contemplated...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0232H01L31/18G01N21/45
CPCH01L27/14627H01L27/1462H01L27/14685H01L31/02165H01L31/02327H01L31/18
Inventor I·尤里格A·基尔施纳D·奥芬贝格B·波伊奇克B·绍斯纳T·施密兹-许布施M·福格特
Owner INFINEON TECH AG