Thermocouple temperature measuring probe, temperature measuring device using same and cooker

A technology of temperature measuring probe and temperature measuring device, which is applied to measuring devices, thermometers using electrical devices, and thermometers that are directly sensitive to heat, can solve the problems of inaccurate measurement of thermistors, and eliminate the temperature Offset, the effect of improving accuracy

Pending Publication Date: 2019-05-07
VATTI CORP LTD
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  • Abstract
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  • Claims
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Problems solved by technology

[0003] The purpose of the present invention is to provide a thermocouple temperature measuring probe, which solves the problem of inaccurate measurement of thermistors in temperature measurement by using thermocouple wires instead of thermistors for temperature measurement

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  • Thermocouple temperature measuring probe, temperature measuring device using same and cooker
  • Thermocouple temperature measuring probe, temperature measuring device using same and cooker
  • Thermocouple temperature measuring probe, temperature measuring device using same and cooker

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] Embodiment 1 of the present invention provides a thermocouple temperature measuring probe, such as figure 1 As shown, it includes a temperature measuring cap 1, a thermocouple wire 2 and a housing 3, the temperature measuring cap 1 is connected to the housing 3, the thermocouple wire 2 is arranged in the housing 3 and one end is fixed on the temperature measuring cap 1 through the housing 3, In this way, by using the thermocouple wire 2 instead of the thermistor for temperature measurement, the temperature measurement accuracy is high and relatively stable. In addition, the outer casing 3 ca...

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Abstract

The invention discloses a thermocouple temperature measuring probe, a temperature measuring device using the same, and a cooker. The thermocouple temperature measuring probe comprises a temperature measuring cap, a thermocouple wire and a casing. The temperature measuring cap is connected with the casing. The thermocouple wire is arranged inside the casing, and one end passes through the casing and is fixed on the temperature measuring cap. The temperature measuring cap is made of a flexible and durable high-temperature material, can be close to a pot, and collects the heat of the pot in realtime. The temperature of the temperature measuring cap rises with the rise of the temperature of the bottom of the pot. The thermocouple wire converts the temperature into an electrical signal and transmits the electrical signal to an external control device, and the temperature of the bottom of the pot is measured. According to the invention, the thermocouple wire replaces a thermistor for temperature measurement, and the temperature measurement accuracy reaches 0.4%; temperature shift of the thermistor at high temperature for a long time is eliminated; and the measurement accuracy is improved.

Description

technical field [0001] The invention belongs to the technical field of kitchen heating devices, and in particular relates to a thermocouple temperature measuring probe, a temperature measuring device using the same and a cooker. Background technique [0002] At present, the temperature measuring probes of smart cookers are mainly NTC or PTC thermistors, which use different resistance values ​​at different temperatures to measure the temperature of the bottom of the pot in contact with it, so as to realize intelligent functions, but it has the following disadvantages: first, heat The pins of the thermistor must be welded with the wires, and the pins and wires will fall off due to solder joint corrosion and virtual welding, so that the temperature measurement will fail; secondly, the thermistor and the temperature measuring cap are packaged with a high-temperature adhesive layer, so The thermistor can only indirectly measure the temperature of the temperature measuring cap thr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/02
Inventor 罗峰易洪斌徐关云潘叶江
Owner VATTI CORP LTD
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