A chemical-mechanical-mechanical-chemical collaborative micro-grinding method and composite abrasive micro-abrasive tool

Abstract

The invention discloses a chemical mechanical-mechanochemical synergistic fine grinding machining method and a used composite grain type micro grinding tool for complex structural micro parts of silicon and silicon-based hard and brittle materials of silicon carbide, K9 optical glass and the like. The machining method comprises the following steps that 1) a machining layer is corroded and modifiedby a grinding fluid, 2) coarse grains of the grinding tool are used for grinding to remove the modified layer, 3) the steps 1)-2) are repeated, 4) supply of the grinding fluid is stopped, 5) fine grains of the grinding tool are used for grinding to remove a margin layer, and 6) sundries on the surface are cleaned away. According to the method and the grinding tool, the grinding tool is a two-stage composite grain type micro grinding tool composed of different sizes and different types of grains, a smoother grinding tool is not needed in the machining process, the machining advantages of chemical mechanical grinding, mechanochemical grinding and fine grinding are combined, so that high geometric precision, high surface quality and high efficiency machining of the complex structural micro parts of the silicon and silicon-based materials can be realized, the machining method is simple and convenient, the cost is low, and the industrial production requirements can be completely met.

Description

technical field [0001] The invention relates to a high-precision and high-efficiency processing method for silicon, silicon carbide, K9 optical glass and other silicon and silicon-based hard and brittle materials with complex structures and tiny parts, and a composite abrasive micro-abrasive tool used in the processing method, which belongs to ultra-precision processing field. Background technique [0002] In recent years, with the rapid development of cutting-edge industries such as aerospace, defense industry, microelectronics industry, modern medicine and bioengineering, the demand for ultra-precision and complex structure micro-parts is increasingly urgent, such as sensors, fluid equipment, optical components, etc. These complex structural parts have many types of materials, complex structures and high precision requirements, which put forward high requirements for the corresponding manufacturing technology. Especially as silicon, silicon carbide, K9 optical glass and o...

AI Technical Summary

Problems solved by technology

The main processing methods for tiny parts of silicon-based materials are etching, photolithography, LIGA (lithography electroforming) and other technologies based on micro-electro-mechanical processing technology (MEMT), but these technologies have a single processing structure (two-dimensional structure), processing Low efficiency, harsh processing conditions and high cost of processing equipment

In addition, micro-EDM, electrochemical and other processing methods are also used in the processing of ultra-precision and complex small parts, but the processing accuracy and processing efficiency are difficult to meet the requirements, and complex three-dimensional structures cannot be processed

At present, a micro-grinding method using a micro-grinding rod (also called a micro-grinding needle) has been proposed to process tiny parts with complex structures of hard and brittle materials. Processing damage defects such as pits, and the wear of the micro-grinding rod is very fast, and the processing efficiency is low

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