Method for preparing light emitting diode device

Abstract

The invention provides a method for preparing a light emitting diode device, belonging to the technical field of display. The method for preparing the light emitting diode device comprises the following steps: forming an intermediate layer and a light emitting diode layer sequentially stacked in a direction away from an auxiliary substrate on the auxiliary substrate, wherein the intermediate layerincludes at least one intermediate structure, and the light emitting diode layer includes at least one light emitting diode structure group corresponding to the at least one intermediate structure inone-to-one correspondence; attaching the auxiliary substrate to a target substrate, and placing the light emitting diode layer between the intermediate layer and the target substrate; controlling m intermediate structures in the at least one intermediate structure to generate heat, so that one end of the light emitting diode structures stacked by the m intermediate structures near the m intermediate structures are thermally decomposed, m is greater than or equal to 1; and moving the auxiliary substrate away from the target substrate to separate the m intermediate structures from the light emitting diode structures stacked with the m intermediate structures. The invention solves the problem that the method for preparing the light emitting diode device in the related art is relatively simple. The invention is used to prepare the light emitting diode device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for preparing a light emitting diode device. Background technique [0002] Light emitting diode (English: light emitting diode; LED for short) devices are more and more widely used, and LED devices can be applied to lighting, display and other fields. [0003] The LED device includes a target substrate, and an LED structure on the target substrate. In the process of manufacturing the LED device, the LED structure can be formed on the auxiliary substrate first. Next, the auxiliary substrate formed with the LED structure is buckled on the target substrate, and the LED structure is bonded to the target substrate. Afterwards, a laser can be irradiated to the junction of the auxiliary substrate and the LED structure, so that the chemical bonds between the auxiliary substrate and the plurality of functional layers are broken under the action of the laser, and then the auxil...

AI Technical Summary

Problems solved by technology

[0005] The present application provides a method for preparing a light-emitting diode device, which can solve the problem in the related art that the method of preparing a light-emitting diode device is relatively simple. The technical solution is as follows:

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