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A connector and electronic equipment

A connector and connection surface technology, applied in the field of communication, can solve problems affecting the cooling effect of the system

Active Publication Date: 2020-06-16
XFUSION DIGITAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the cold air for heat dissipation of the system passes through the gaps between the hard disks 10, it also needs to pass through the openings on the hard disk backplane 20 to continue to dissipate heat inside the system, so that the hard disk backplane 20 forms a barrier in the system cooling air duct to block the flow of air. , which seriously affects the cooling effect of the system

Method used

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  • A connector and electronic equipment
  • A connector and electronic equipment
  • A connector and electronic equipment

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Embodiment Construction

[0032] In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings.

[0033] An embodiment of the present application provides a connector, which is used to connect a first device and a second device. The above-mentioned connector is applied to devices such as servers and storage devices. Specifically, the above-mentioned first device can be a For the hard disk, the above-mentioned second component may be a hard disk backplane electrically connected to the above-mentioned hard disk for information exchange. The connector includes a socket slot for connecting the first device, and a connecting surface for connecting the second device. The connector will be described in detail below with reference to the accompanying drawings.

[0034] refer to figure 2 , image 3 and Figure 5b , the connector includes a connector body 30, a receptacle 31 ...

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Abstract

The application provides a connector and an electronic device. The connector is used for connecting a first device and a second device; and the connector includes a connector body, an insertion slot disposed on the connector body for connecting the first device, and a connecting surface disposed on the connector body for connecting the second device. At least one row of contacts is arranged on theinsertion slot; plurality rows of pins are arranged on the connecting surface, and each row of contacts corresponds to at least two rows of pins; and the contacts in each row of contacts are electrically connected to the pins of the at least two rows of pins corresponding to the row of contacts in one-to-one correspondence, so as to reduce the length of the connector body and increase the applicability of the connector. The contacts in each row of contacts are arranged from closing to the connecting surface to keeping away from the connecting surface; and the pins in each row of pins are arranged from closing the slot of the insertion slot to keeping away from the slot of the insertion slot; so that the insertion and removal direction of the insertion slot intersects with the insertion and removal direction of the connecting surface; therefore, the ventilation and heat dissipation effects in the system are improved.

Description

technical field [0001] The present application relates to the technical field of communications, and in particular to a connector and electronic equipment. Background technique [0002] In the hardware architecture of servers and storage products, in order to facilitate the maintenance of hard disks, generally hard disks are placed on the front of the device and connected to the motherboard through the hard disk backplane. refer to Figure 1a and Figure 1b , the current hard disk backplane 20 is generally vertically arranged, and the hard disk 10 is arranged and inserted on the hard disk backplane 20, and the plugging direction of the hard disk 10 is perpendicular to the hard disk backplane 20. After the cold air for heat dissipation of the system passes through the gaps between the hard disks 10, it also needs to pass through the openings on the hard disk backplane 20 to continue to dissipate heat inside the system, so that the hard disk backplane 20 forms a barrier in th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R12/73
Inventor 邓治高张波
Owner XFUSION DIGITAL TECH CO LTD