Method for rapidly assembling, disassembling and replacing cold plate component of multi-layer liquid cooling frame

Abstract

The invention discloses a method for rapidly assembling, disassembling and replacing a cold plate component of a multi-layer liquid cooling frame, and aims to provide a method for effectively reducingthe period and the cost of replacing the cold plate component of the liquid cooling frame and avoiding the drainage problem in a cold plate replacing process. The method disclosed by the invention isrealized through the technical scheme as follows: insertion, extraction guidance and support of the cold plate component are realized by adoption of double U-shaped guide grooves in the installationarea of the cold plate component; at the matched position of the tail ends of sliding blocks at two sides where the cold plate component is inserted to the bottom, locating is carried out by adoptionof a stop step matched with the tail end of the double U-shaped guide grooves; the cold plate component is inserted into an insertion and extraction drawer sliding rail through inner guide grooves ofvertical plates at two sides of the liquid cooling frame; self-sealing fluid connectors are installed at a liquid inlet and a liquid outlet; after being rapidly in butt joint and automatically sealed,the self-sealing fluid connectors fixedly connected at two sides of the cold plate component are communicated with a circulating flow channel introducing to a fluid cold plate component; circulationis carried out by introducing cooling liquid; rapid heat conduction is carried out through auxiliary modules and units; and the cold plate component can be rapidly separated by releasing the self-sealing fluid connectors.

Description

technical field [0001] The invention relates to a method for quickly disassembling and replacing a cold plate assembly based on a comprehensive modular liquid-cooled frame structure. Background technique [0002] With the improvement of miniaturization, modularization and high integration design requirements of electronic equipment, the heat dissipation of various electronic equipment has also increased correspondingly, the power density and heat flux density of electronic equipment have been greatly increased, the heat is concentrated, and the local temperature is too high. If the heat cannot If it is released in time, it will cause the performance of electronic equipment to decline or even fail. Generally speaking, every time the temperature rises by 10°C, the reliability may be reduced to half of the original, while the temperature increases from 75°C to 125°C, and the reliability becomes 20% of the original. Depending on the application environment, the traditional air-...

AI Technical Summary

Problems solved by technology

In addition, in the process of replacing the cold plate, it is necessary to loosen statically sealed flanges and other joints, which will cause the residual coolant inside the cold plate to flow out. Once it is not handled properly, it will pollute the entire equipment and bring great inconvenience to maintenance work.

Images