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A laser shaping method for mobile phone middle board

A laser and mobile phone technology, used in telephone structures, manufacturing tools, laser welding equipment, etc., can solve the problems of manpower and time waste, plastic instability, etc., to improve production efficiency, save plastic manpower and plastic time, and reduce production. cost effect

Active Publication Date: 2021-08-24
CHITWING DONGGUAN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is that, aiming at the defects of the existing technology, the present invention provides a method for laser shaping of the middle board of a mobile phone, aiming at solving the problem of unstable shaping in the prior art and waste of manpower and time caused by repeated shaping

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  • A laser shaping method for mobile phone middle board
  • A laser shaping method for mobile phone middle board
  • A laser shaping method for mobile phone middle board

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Embodiment Construction

[0034] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0035] Such as image 3 , Figure 4 As shown, the present invention proposes a laser shaping method for a mobile phone middle plate, which includes the following steps:

[0036] S10, the middle board of the mobile phone is loaded into the positioning jig and the middle board of the mobile phone is positioned.

[0037] The specific process is as follows: the mobile phone mid-plane needs to be reshaped through numerical control processing. In this embodiment, the mobile phone mid-panel is the mobile phone mid-panel. The face of the mobile phone mid-panel where the LCD screen needs to be ...

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Abstract

The invention discloses a laser shaping method for a mobile phone middle board. The steps include: loading the mobile phone middle board into a positioning jig and positioning the mobile phone middle board; turning on a laser machine and performing laser shaping on the laser shaping area of ​​the mobile phone middle board; Clean up the laser shaping area of ​​the middle plate of the mobile phone; test the flatness of the laser shaping area of ​​the middle plate of the mobile phone. The method provided by the present invention oxidizes the surface of the middle plate of the mobile phone through the laser beam, so that the flatness of the laser shaping area reaches the tolerance requirement of +0.05 / -0.15MM, and the middle plate of the mobile phone is not deformed by external force, thereby The shaping effect can be achieved stably, and the yield rate can reach 100% in one shaping, which saves manpower and shaping time, adopts automatic control of positioning and programming, is suitable for mass production and processing, improves production efficiency, and reduces production costs.

Description

technical field [0001] The invention relates to the field of production and processing of mobile phone middle plates, in particular to a laser shaping method for mobile phone middle plates. Background technique [0002] Such as figure 1 As shown, in the mobile phone structure, the LCD screen of the mobile phone needs to be installed on the middle board 10 of the mobile phone, so there is a flatness requirement for the area where the LCD screen is installed on the middle board of the mobile phone. The flatness of the LCD area of ​​the middle board of the mobile phone requires a tolerance of +0.05 / -0.15, and the deformation direction is required. The middle board of the mobile phone can only protrude toward the battery, not the screen. There will be a risk of top screen, causing screen watermarks. [0003] The LCD area of ​​the existing mobile phone middle panel is usually a thin plate with a thickness of only 0.5mm and a large area. During CNC machining, the flatness will b...

Claims

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Application Information

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IPC IPC(8): B23K26/00B23K26/70H04M1/02
Inventor 颜金军陈习文黄喜明
Owner CHITWING DONGGUAN TECH
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