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Heat sink

A technology for radiators and connecting parts, applied to heat exchange equipment, heat exchanger types, indirect heat exchangers, etc., to achieve the effects of simple and easy erection, enhanced effect, and reduced complexity

Active Publication Date: 2019-05-24
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In order to effectively reduce the excessive heat generated by large-scale equipment or electronic devices during operation, which will affect the operating efficiency or even cause damage, how to achieve effective heat dissipation is undoubtedly a very important issue.

Method used

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Embodiment Construction

[0046] Several embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some existing conventional structures and components will be shown in a simple and schematic manner in the drawings. And if possible in practice, the features of different embodiments can be applied interactively.

[0047] Please refer to figure 1 , which is a three-dimensional schematic diagram illustrating the heat sink 100 according to an embodiment of the present invention. In this embodiment, if figure 1 As shown, a radiator 100 is suitable for use in an immersion cooling system (not shown). The radiator 100 includes ...

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Abstract

The invention discloses a heat sink comprising a plurality of first pipes. The first pipes are connected with one another to form a first ring structure. The first pipes are configured to allow cooling fluid to circulate. The first pipes have width and height perpendicular to each other, and the height is greater than the width.

Description

technical field [0001] The present invention relates to a heat sink, and more particularly to a heat sink for a two-phase immersion cooling system. Background technique [0002] In order to effectively reduce the excessive heat generated by large equipment or electronic devices during operation, which may affect the operating efficiency or even cause damage, how to achieve an effective heat dissipation effect is undoubtedly a very important issue. [0003] In the application of the immersion cooling system, the user immerses the equipment that generates heat during operation into the cooling box, and the cooling box is usually provided with a radiator to take away the high temperature in the cooling box. Contents of the invention [0004] One of the objectives of the present invention is to provide a radiator, which can enhance the effect of heat exchange with the heated fluid. [0005] According to an embodiment of the present invention, a radiator includes a plurality o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20263F28D2001/0266F28D1/0426F28D1/05366F28D2021/0031F28D1/0213H05K7/203F28D1/05383F28D1/05333F28F1/04F28F1/022
Inventor 童凯炀陈虹汝
Owner INVENTEC PUDONG TECH CORPOARTION