Poly-polyphenyl modified fluorine-containing resin mixture and prepreg and copper-clad plate prepared therefrom

Abstract

The invention relates to a poly-polyphenyl modified fluorine-containing resin mixture and prepreg and a copper-clad plate prepared therefrom. Poly-polyphenyl is modified on the surfaces of inorganic filler and glass fiber fabric, so that dispersity of the inorganic filler in a fluorine-containing resin matrix, compatibility among the inorganic filler, the glass fiber cloth and fluorine-containingresin is improved, and interaction force among the inorganic filler, the fluorine-retaining resin, the glass fiber cloth and a copper foil is enhanced. Further, a high-frequency copper-clad plate madeby using the prepreg, a film and the copper foil is good in thermal-mechanical performance, excellent in dielectric performance, high in comprehensive performance stability, excellent in uniformity,especially high in striping strength of the copper foil and capable of meeting various comprehensive performance requirements of the high-frequency communication field on a substrate material.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a polypolyphenol-modified fluorine-containing resin mixture and a prepreg and a copper-clad laminate prepared therefrom. Background technique [0002] At present, the information electronics industry is in a stage of rapid development and is gradually becoming one of the pillar industries of various countries. CCL is one of the key materials in the information electronics industry. It has been widely used in communication base stations, satellites, vending machines, computers, mobile phones and even gradually emerging wearable devices, driverless cars, drones and intelligent robots. field. [0003] So far, such as US patents US3136680, US4335180, US4849284, US5024871, US5922453, US2539329, US4623505, US4647508, US4886699 and Chinese patents CN2014103766915, CN201010180034, etc. have developed a variety of methods for preparing copper-clad laminates containing f...

AI Technical Summary

Problems solved by technology

However, fluorine-containing resins generally cannot chemically react with coupling agents, so it is difficult to form chemical bonds between the fluorine-containing resin matrix and inorganic fillers, glass fiber cloth or copper foil

In addition, the interaction between the common alkane chain at one end of the commonly used coupling agent and the fluorine-containing polymer chain is also very weak.

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