A double fpc flipping automatic bonding mechanism

Abstract

The invention discloses a double-FPC turnover automatic bonding mechanism, which comprises a platform Y-axis mechanism, a platform X-axis mechanism, a platform Q-axis mechanism, a supporting back-up mechanism, a TP turnover mechanism and an FPC auxiliary pressing rod mechanism, wherein the FPC auxiliary pressing rod mechanism is mounted on the TP turnover mechanism, the TP turnover mechanism and the supporting back-up mechanism are mounted on the platform Q-axis mechanism respectively and do reciprocation motion along the Q axis under the driving of the platform Q-axis mechanism, the platformQ-axis mechanism is mounted on the platform X-axis mechanism and does reciprocation motion along the X-axis under the driving of the platform X-axis mechanism, and the platform X-axis mechanism is mounted on the platform Y-axis mechanism and does reciprocation motion along the Y-axis under the driving of the platform Y-axis mechanism. The double-FPC turnover automatic bonding mechanism realizes the automation of opening the Driver FPC and bonding the ACF onto the TP FPC, reduces the number of manual operations in the whole process, improves the production efficiency, reduces the risk in the production process, and improves the product yield.

Description

technical field [0001] The invention relates to an important mechanism for automatic alignment detection of TFOF manufacturing process equipment FPC and FPC bonding equipment. Specifically, it is a double FPC flipping automatic bonding mechanism. Background technique [0002] In the existing technology, the FPC bonding equipment CCD visual alignment of TFOF equipment is one of its important mechanisms. In this technology, domestic and foreign equipment suppliers mostly use semi-automatic manual work because the two FPC bonding areas will overlap. After opening the Driver FPC, bind the ACF on the TP FPC. [0003] It has the following disadvantages: [0004] 1. Most of the existing technologies use manual binding of the Driver FPC to the TP with masking glue, and put it into a manual bonding machine for ACF attachment. Due to the increase in the manufacturing process, the risk in the production process increases and the production is reduced. yield. [0005] 2. In the exis...

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Problems solved by technology

[0004] 1. Most of the existing technologies use manual binding of the Driver FPC to the TP with masking glue, and put it into a manual bonding machine for ACF attachment. Due to the increase in the manufacturing process, the risk in the production process increases and the production is reduced. Yield

[0005] 2. In the existing technology, most of the FPC alignment methods use manual fine-tuning frame alignment. The stability of manual multiple operations is not as good as the repeatability of the equipment, and the alignment time is not as good as the automatic identification and calculation of the equipment, which increases the time in the alignment process. Reduced efficiency and poor alignment stability, which in turn increases costs and reduces production yield

[0006] 3. In the existing technology, the FPC area is small, and there may be problems such as insufficient vacuum degree and unstable adsorption during the adsorption process, resulting in product falling off and damage, or bonding ACF deviation, etc.

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