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Device for removing heat and its manufacturing method

A technology of equipment and heat-conducting elements, which is applied in the field of heat-extracting equipment and its manufacturing, can solve space problems and other problems, and achieve the effect of improving heat conduction capacity or heat distribution

Active Publication Date: 2021-11-09
ZF FRIEDRICHSHAFEN AG
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This can cause space issues when installing the equipment

Method used

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  • Device for removing heat and its manufacturing method
  • Device for removing heat and its manufacturing method
  • Device for removing heat and its manufacturing method

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Embodiment Construction

[0023] For better thermal connection or heat dissipation between the heat sink and the components arranged on the printed circuit board, the method according to the invention makes it possible to dispense with intermediate layers. For better heat-conducting connection of the cooling body, the heat-conducting element can be integrated directly into the cooling body, or it can be integrated as a separate component during manufacture. The heat-conducting element has a special structure and is preferably at least partially filled with a heat-conducting medium, hereinafter only referred to as medium. The medium can here be present with or without circulation in the closed heat-conducting element or be in contact with the respective component, ie the heat-conducting element has a direction along the component(s) on which it is arranged Open structure. Thermally conductive elements can also be purchased or manufactured as separate components to be mounted on one or more components a...

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Abstract

A device for dissipating heat is provided, wherein the device has at least one power module comprising a circuit board (2) and a component to be cooled (3) arranged on the circuit board and arranged on the circuit board ( 2) at least one cooling body (1) on and arranged above the parts to be cooled (3), wherein at least one heat conducting element (100) is respectively arranged on at least one part to be cooled (3), the heat conducting The element has a predetermined structure, which extends from the circuit board (2) into the heat sink (1) in a direction away from the circuit board (2), and wherein the heat conducting element (100) has in its interior a medium.

Description

technical field [0001] The invention relates to a device for removing heat and a method for its manufacture. Background technique [0002] Heat-conducting elements such as heat sinks are used in power electronics and control units for cooling various components, for example components or structures on circuit boards. Due to tolerances and existing surface properties, direct contact of the heat sink to the component is not optimal for heat transfer. Therefore, in the currently known heat dissipation strategies, it is necessary to introduce a gap-filled and thermally conductive layer for better thermal connection, as in figure 1 as shown in reference number 4. Such a gap-filling and heat-conducting layer 4 can be a heat-conducting paste or a so-called caulk which is arranged on the corresponding component 3 , that is to say a component, structure or process which is arranged, for example, on the circuit board 2 . on the hole. Both thermal paste and caulk require a certain ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20F28D15/02
CPCH05K7/20336H05K7/20936F28D15/0233F28F2255/18H01L23/427B33Y80/00
Inventor 马蒂亚斯·霍伊斯尔曼马库斯·鲍恩芬德赫尔曼·约瑟夫·罗宾库尔特·米歇尔
Owner ZF FRIEDRICHSHAFEN AG
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