PRINTED CIRCUIT BOARD WITH BENT CONNECTING SECTION AND METHOD FOR TESTING or PRODUCING SAID PRINTED CIRCUIT BOARD, AND ALSO ELECTRONIC CONTROL UNIT AND METHOD FOR OPERATING SAID ELECTRONIC CONTROL UNIT

A technology for printed circuit boards and connecting parts, which is applied in the field of control equipment, and can solve problems such as damage to bend parts that cannot be used

Active Publication Date: 2019-06-07
VTESCO TECH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The problem in such printed circuit boards is that conventional methods cannot be used after bending to check whether the bend was damaged during bending
Damage to bends cannot be detected during manufacture

Method used

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  • PRINTED CIRCUIT BOARD WITH BENT CONNECTING SECTION AND METHOD FOR TESTING or PRODUCING SAID PRINTED CIRCUIT BOARD, AND ALSO ELECTRONIC CONTROL UNIT AND METHOD FOR OPERATING SAID ELECTRONIC CONTROL UNIT
  • PRINTED CIRCUIT BOARD WITH BENT CONNECTING SECTION AND METHOD FOR TESTING or PRODUCING SAID PRINTED CIRCUIT BOARD, AND ALSO ELECTRONIC CONTROL UNIT AND METHOD FOR OPERATING SAID ELECTRONIC CONTROL UNIT

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] figure 1 A plan view of a printed circuit board L according to an embodiment of the present invention is shown during a stage of a method of manufacturing a printed circuit board according to the present invention. To improve the readability of the drawings, the conductor tracks of the printed circuit board L are in figure 1 are shown hatched in , and the area between the printed circuit boards is not hatched.

[0038] figure 2 A schematic sectional view of an electronic control device ECU including a completed printed circuit board L according to an embodiment of the present invention is shown.

[0039] The printed circuit board L has a first main part H1 provided for mounting electronic components. For example, the first main part is equipped with an integrated circuit IC.

[0040] Furthermore, the printed circuit board L has a second main part H2 which is for example equipped with a plug-in device ST. In the present case, the plug connector ST is provided for t...

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PUM

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Abstract

The invention specifies a method for testing a printed circuit board (L), in which method a printed circuit board (L) is provided with a first main section (H1), a second main section (H2), a bent connecting section (V) and at least one monitoring conductor track (S, S1', S2). The connecting section (V) is arranged between the first main section (H1) and the second main section (H2). The monitoring conductor track (S, S1', S2) runs from the first main section (H1), in a curved manner through the connecting section (V), to the second main section (H2). At least one electrical measurement valuewhich is representative of the integrity of the at least one monitoring conductor track (S, S1', S2) is detected in the method. In addition, a printed circuit board (L), a control unit (ECU), and alsomethods for producing the printed circuit board (L) and for operating the control unit (ECU) are specified.

Description

technical field [0001] The invention relates to a method for testing a printed circuit board with bent connections, a method for manufacturing a printed circuit board with bent connections, a method for operating an electronic control device and a A printed circuit board with curved connection portions and a control device. Background technique [0002] For example, WO 2005 / 089033 A1 discloses a printed circuit board which has bendable sections, so that the printed circuit board can be bent and retains its bent shape after bending. [0003] The problem with such printed circuit boards is that conventional methods cannot be used after bending to check whether the bend was damaged during bending. Damage to the bend cannot be detected during manufacture. Contents of the invention [0004] It is therefore the object of the present disclosure to provide a method for testing printed circuit boards with bent connections. A further object of the present disclosure is to provide...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28H05K1/02H05K3/46
CPCG01R31/2812H05K1/0268H05K1/0278H05K3/4691H05K2201/0382H05K2203/302G01R31/2818H05K2203/162
Inventor D.巴贡H.霍恩
Owner VTESCO TECH GMBH
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