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COB production process capable of detecting LED temperature

A technology of production process and temperature measurement points, applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve the problem of inability to accurately determine whether the COB power matches, no temperature measurement points, etc., to facilitate long-term monitoring , reduce production efficiency, facilitate the effect of popularization and application

Active Publication Date: 2019-06-14
珠海市协宇电子有限公司
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AI Technical Summary

Problems solved by technology

[0002] COB is a high-efficiency integrated surface light source technology in which LED chips are directly attached to a high-reflectivity mirror metal substrate. This technology eliminates the concept of brackets, no electroplating, no reflow soldering, and no SMT process, so the process is reduced by nearly one-third , the cost is also saved by one-third; the existing COB production process does not have a suitable temperature measurement point to accurately detect the actual temperature of the LED, and thus cannot accurately determine whether the COB area matches the power of the LED it carries

Method used

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Embodiment Construction

[0028] The idea, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, features and effects of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to The protection scope of the present invention.

[0029] Such as figure 1 and figure 2 The board shown is produced by the COB production process that can detect the LED temperature as described below. The production process includes the following steps:

[0030] A. Cutting the substrate 2, using an electric shear to cut the entire substrate into a substrate 2 of the size required for production;

[0031] B. Etching, etch the upper surface of ...

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Abstract

The invention relates to the technical field of circuit board production, in particular to a COB production process capable of detecting LED temperature, which comprises the steps of cutting a substrate, etching, solder resisting, surface treatment, pre-gluing, windowing, pressing and installing a temperature measuring probe, wherein the windowing step comprises the step of arranging a mirror surface window and a temperature measuring point window on the substrate, The production process of the invention arranges a temperature measuring point window on the substrate and a temperature measuringprobe in the temperature measuring point window, and the temperature measuring probe is aligned with the LED, so that the working temperature of the LED can be accurately detected, and accurate datais further provided to calculate whether the COB area is matched with the LED power or not, so that the requirement that the LED does not generate light attenuation is met, and the technical problem that the actual temperature of the LED cannot be tested in the current industry is solved. The temperature measuring probe can also be used for detecting the temperature of the mirror aluminum, and then the temperature when using the LED can be detected, and the effect of the temperature measuring probe lies in prolonging the service life of the temperature measuring probe, which is convenient forlong-term monitoring of LED working temperature.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a COB production process capable of detecting the temperature of LEDs. Background technique [0002] COB is a high-efficiency integrated surface light source technology in which LED chips are directly attached to a high-reflectivity mirror metal substrate. This technology eliminates the concept of brackets, no electroplating, no reflow soldering, and no SMT process, so the process is reduced by nearly one-third , The cost is also saved by one-third; the existing COB production process does not have a suitable temperature measurement point to accurately detect the actual temperature of the LED, and thus cannot accurately determine whether the COB area matches the power of the LED it carries. Contents of the invention [0003] The technical solution adopted by the present invention to solve the above problems is to provide a COB production process capable of dete...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L33/48
Inventor 祁明顺李旵东
Owner 珠海市协宇电子有限公司
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