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Micro element structure

A technology of micro-component and fixed structure, applied in the field of micro-component structure, can solve the problems affecting the yield rate of micro-light emitting diodes and the like

Active Publication Date: 2019-06-25
PLAYNITRIDE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the size and shape of the contact surface between the fixed structure and the micro-LEDs will affect the yield of the transportation and transfer of the micro-LEDs

Method used

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  • Micro element structure
  • Micro element structure
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Embodiment Construction

[0075] Embodiments of the present invention describe the structure of micro-components, such as micro light-emitting diodes (Micro LEDs) or microchips, ready for pick-up and transfer to a receiving substrate. The receiving substrate can be, for example, a display substrate, a light emitting substrate, a substrate with functional elements such as transistors or integrated circuits (ICs), or other substrates with circuits, but is not limited thereto. Although some embodiments of the present invention are specifically described as miniaturized LEDs comprising p-n diodes, it should be understood that embodiments of the present invention are not limited thereto and that certain embodiments are also applicable to other miniature components designed in this manner. In order to control the execution of predetermined electronic functions (such as diodes, transistors, integrated circuits) or photonic functions (LEDs, lasers). Figure 1A It is a schematic top view of a micro-element struc...

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Abstract

The invention provides a micro element structure. The micro element structure comprises a substrate, at least one micro element and at least one fixing structure, the microelement is disposed on the substrate. The microelement has a top surface and a bottom surface opposite each other, a peripheral surface connecting the top surface and the bottom surface, a first-type electrode, and a second-typeelectrode. The fixing structure is arranged on the substrate and is far away from the first type electrode and the second type electrode. The fixing structure comprises at least one connecting part and at least one fixing part. The connecting part is arranged on one edge of the top surface of the micro element. The fixing part is connected with the connecting part and extends to the substrate.

Description

technical field [0001] The invention relates to a semiconductor structure, in particular to a micro element structure. Background technique [0002] At present, the transfer of micro-LEDs is mainly to transfer the micro-LEDs on the carrier substrate to the receiving substrate by means of electrostatic force or magnetic force. Generally speaking, the micro-LEDs are held by a fixed structure so that the micro-LEDs are easier to pick up from the carrier substrate and transported and transferred to the receiving substrate for placement, and the fixed structure is used to consolidate the micro-LEDs. Quality is affected by other external factors. However, the size and shape of the contact surface between the fixing structure and the micro LEDs will affect the yield rate of the transportation and transfer of the micro LEDs. Therefore, how to make the fixing structure temporarily hold the micro-LEDs, and transport and transfer the micro-LEDs between the carrier substrate and the r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48
CPCH01L21/6835H01L27/156H01L25/0753H01L33/0095H01L33/62H01L33/12
Inventor 吴志凌苏义闵罗玉云
Owner PLAYNITRIDE
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