Wafer box rotating mechanism and loading chamber

Abstract

The invention discloses a wafer box rotating mechanism and a loading chamber. The wafer box rotating mechanism comprises a supporting base, a rotating support seat and a moving assembly. The supporting base can move linearly in the vertical direction under the action of a driving force. The rotating support seat is located on the supporting base, and one end of the rotating support seat is rotationally connected with one end of the supporting base. The rotating support seat is used for loading a wafer box. The moving assembly comprises a guide rail, a moving part and an elastic part. The moving part is connected to the side of the rotating support seat. The guide rail is fixedly arranged on the side wall of a loading chamber. During downward movement of the supporting base, the guide railcan contact the moving part and prevent the moving part from moving downward, so that the rotating support seat rotates from a vertical position to a horizontal inverted position. The elastic part isused for exerting a restoring force on the rotating support base so that the rotating support base rotates from the horizontal inverted position to the vertical position. A wafer can be accurately located in a wafer box, the yield of wafer taking can be improved, and the time for wafer taking can be saved.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a chip box rotating mechanism and a loading chamber comprising the chip box rotating mechanism. Background technique [0002] In the traditional semiconductor equipment transmission system, such as figure 1 As shown, the transmission system includes a loading chamber 200 , a transmission chamber 300 and a process chamber 400 , wherein the loading chamber 200 is provided with a cassette 210 and a lifting assembly 220 , and the transmission chamber 300 is provided with a manipulator 310 . Specifically, the lifting assembly 220 drives the cassette 210 to move linearly along the vertical direction, so as to facilitate the manipulator 310 in the transfer chamber 300 to take out wafers from the cassette 210 . Among them, taking out wafers from the cassette 210 is the first step in the automatic transfer process of many semiconductor devices, so the efficiency and relia...

AI Technical Summary

Problems solved by technology

[0009] But in the chip box rotating mechanism of above-mentioned structure, at first, because the kind of wafer is different, coefficient of friction is different, under the situation that inclination angle is not enough when tilting, wafer may not be able to slide to the notch of chip box rear portion, and tilts The angle is limited by the center of gravity of the mechanism and cannot exceed the center of rotation, otherwise the film cassette cannot be returned when it is poured out

Secondly, the entire loading action requires the operator to put the cassette into the chamber, which requires a wide opening of the chamber, and the operation action is not ergonomic, which may easily cause mistakes and cause the wafer to slip out

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