2results about How to "Improve chip yield" patented technology

The application provides a CMOS-MEMS integrated pressure sensor and a preparation process thereof. The pressure sensor comprises a bonded MEMS wafer and a CMOS wafer; a bonding sealing area and a PAD vertical interconnection structure in the bonding sealing area are arranged between the MEMS wafer and the CMOS wafer; the bonding sealing structure is formed by eutectic bonding of a metallization layer and a metal solder ball formed in corresponding bonding areas of the two wafers, and the bonding sealing structure surrounds a sensitive element to form a sealed cavity; the PAD vertical interconnection structure comprises conductive bumps respectively formed on the two wafers, the two conductive bumps are aligned with each other and bonded, and electrical interconnection between the MEMS wafer and the CMOS wafer is realized. The electrical interconnection of the pressure sensor realizes monolithic integration, not only improves the problems of increased signal transmission loss, reduced detection precision caused by additional parasitic resistance, capacitance and inductance introduced by wire bonding, and external noise interference, but also improves the service life and reliability, and reduces the size of the chip.

The present invention relates to a portable quick grounding device, comprising an electric hammer, a grounding rod and a lap cap, wherein the grounding rod comprises a grounding rod body and a grounding rod head and a grounding rod handle respectively arranged at two ends of the grounding rod body, wherein the grounding rod body is provided with a spiral texture, and in the grounding and withdrawal operation state, the grounding rod handle is arranged in the hammer head mounting hole of the electric hammer, and in the grounding state, the lap cap is installed on the grounding rod handle, and the lap cap is provided with a positioning mechanism for stabilizing the grounding rod handle and an auxiliary mechanism for withdrawing the grounding rod from the ground. Compared with the prior art, the present invention has the advantages of quick grounding, reusable components, and convenient carrying.