Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

178results about How to "Difference" patented technology

Method for dynamically adjusting an interactive application such as a videogame based on continuing assessments of user capability

A method of balancing a user's input to an interactive computer program with the program's output is obtained by continually measuring the difference between the user's input and the program's output and adjusting one or more parameters of the program's output so that the difference from the user's performance is progressively reduced. The adjustment may be obtained dynamically through negative feedback dampening of the measured difference (delta) between user input and program output, and/or by selection of predetermined apposite values for program output corresponding to the measurement of user input. The adjustment results in dynamic generation and/or selection of premodeled segments of interactive output in closer balance with user input. The adjustment method can be applied to video games, educational games, productivity programs, training programs, biofeedback programs, entertainment programs, and other interactive programs. In video games, the adjustment method results in balancing user performance with game difficulty for a more engaging game experience. It can also enable embedded advertising to be triggered when the user is in an optimum state of engagement. The adjustment method may be performed by projecting future trends of user performance, selecting predetermined or dynamically determined levels of value, modifying user control of input devices, or even modifying the program's challenges to user capability over time.
Owner:CONKWRIGHT GEORGE COLBY

Method For Displaying Recognition Result Obtained By Three-Dimensional Visual Sensor And Three-Dimensional Visual Sensor

Display suitable to an actual three-dimensional model or a recognition-target object is performed when stereoscopic display of a three-dimensional model is performed while correlated to an image used in three-dimensional recognition processing. After a position and a rotation angle of a workpiece are recognized through recognition processing using the three-dimensional model, coordinate transformation of the three-dimensional model is performed based on the recognition result, and a post-coordinate-transformation Z-coordinate is corrected according to an angle (elevation angle f) formed between a direction of a line of sight and an imaging surface. Then perspective transformation of the post-correction three-dimensional model into a coordinate system of a camera of a processing object is performed, and a height according to a pre-correction Z-coordinate at a corresponding point of the pre-coordinate-transformation three-dimensional model is set to each point of a produced projection image. Projection processing is performed from a specified direction of a line of sight to a point group that is three-dimensionally distributed by the processing, thereby producing a stereoscopic image of the three-dimensional model.
Owner:ORMON CORP

Semiconductor device

A technology providing an improvement in the durability in the condition of changing the temperature, while ensuring characteristics such as the applicability to applications utilizing larger electric current, lower resistance and the like can be achieved. A semiconductor device 100 includes a ceramic multiple-layered interconnect substrate 120, a silicon chip 110 that is flip-bonded to a chip-carrying region of the ceramic multiple-layered interconnect substrate 120, and an external connecting bumps 161 and an external connecting bumps 163, which are provided in the side that the silicon chip 110 of the ceramic multiple-layered interconnect substrate 120 is carried. The silicon chip 110 includes a front surface electrode and a back surface electrode. The ceramic multiple-layered interconnect substrate 120 includes an interconnect layer composed of a conductive material, and the interconnect layer composes a multiple-layered interconnect layer provided on a front surface and in an interior of the ceramic multiple-layered interconnect substrate 120. The front surface electrode of the silicon chip is electrically connected to the external connecting bump 161 and the external connecting bump 163 through the multiple-layered interconnects in the multiple-layered interconnect layer.
Owner:RENESAS ELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products