Novel servo substrate for high-power low-voltage servo driver and servo driver

Abstract

The invention discloses a novel servo substrate for a high-power low-voltage servo driver and the servo driver, and the servo substrate comprises a bottom substrate which is used for heat dissipationof a power loop; a circuit layer which is arranged above the bottom substrate and serves as a physical carrier of an analog signal sensing circuit and the power loop; an insulation heat conduction layer which is arranged between the circuit layer and the bottom substrate and is used for insulation and heat conduction between the circuit layer and the bottom substrate. The circuit layer is providedwith a through hole which is through vertically, and the circuit layer transmits the heat of the power loop to the insulation heat conduction layer through the through hole and transmits the heat tothe bottom substrate through the insulation heat conduction layer. The through hole is formed in the circuit layer, the heat of the power loop is conducted to the aluminum substrate to dissipate the heat of the power loop, the thermal resistance is greatly reduced, the requirements for high-power output and miniaturization under the high-temperature environment are met, the cost is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of servo drives, in particular to a novel servo substrate and a servo drive for high-power low-voltage servo drives. Background technique [0002] With the development of industrial automation technologies such as robots, more and more servos are used. For multi-degree-of-freedom robots or other special equipment that requires multi-axis coordination, the number of servos used in a system is increasing, as few as 4 -6, as many as 12-14 or more, the space occupied by the servo is getting larger and larger, which is very inconvenient and economical for the use of the equipment, and it is even more impossible to realize the design integrated with the motor. At present, most of the power devices of low-power servos are connected to heat sinks and naturally cooled by air to dissipate heat. The thermal resistance of heat dissipation is large. The same power temperature rise requires a large heat dissipation area, which is d...

AI Technical Summary

Problems solved by technology

[0002] With the development of industrial automation technologies such as robots, more and more servos are used. For multi-degree-of-freedom robots or other special equipment that requires multi-axis coordination, the number of servos used in a system is increasing, as few as 4 -6, as many as 12-14 or more, the space occupied by the servo is getting bigger and bigger, which is very inconvenient and economical for the use of equipment, and it is impossible to realize the design integrated with the motor

At present, most of the power devices of low-power servos are connected to heat sinks and naturally cooled by air to dissipate heat. The thermal resistance of heat dissipation is large. The same power temperature rise requires a large heat dissipation area, which is difficult to miniaturize and cannot meet the ambient temperature. The high working conditions cannot meet the needs of high power output and miniaturized size under high ambient temperature

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