A boron nitride aggregate, a thermosetting resin composition containing it and its use

Abstract

The invention relates to a boron nitride agglomerate, which is a multi-level structure composed of flake-shaped hexagonal boron nitride primary particles connected and arranged in three dimensions through an inorganic binder; the invention also relates to a boron nitride agglomerate. A method for preparing the boron nitride agglomerate, which is by mixing flake-shaped hexagonal boron nitride primary particles with an inorganic binder, and controlling the quality of the inorganic binder to account for 0.02% of the mass of the flake-shaped hexagonal boron nitride primary particles ~20%, to obtain the boron nitride aggregate; the boron nitride aggregate provided by the present invention can be added to the thermosetting resin composition, and the resin sheet, resin composite metal foil, prepreg, Laminates, metal-clad laminates, and printed circuit boards all have higher boron nitride additions, high thermal conductivity, and high peel strength.

Description

technical field [0001] The invention belongs to the technical field of macromolecules, and in particular relates to a boron nitride aggregate, a thermosetting resin composition containing it and an application thereof. Background technique [0002] In recent years, in order to obtain higher material thermal conductivity in resin compositions or composite materials, boron nitride and alumina fillers with higher thermal conductivity are gradually used to obtain higher thermal conductivity in resin compositions or composite materials Become a reality, and further improve the heat dissipation capacity of the material. The basic structure of general thin layered boron nitride is as follows: figure 1 shown. However, for general thin-layer flaky boron nitride, it is easy to agglomerate and difficult to disperse when added to the resin composition, and it will also lead to a decrease in the peel strength between the resin polymer and other metals. [0003] CN103249695A discloses ...

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Problems solved by technology

However, for general thin-layer flaky boron nitride, it is easy to agglomerate and difficult to disperse when added to the resin composition, and it will also lead to a decrease in the peel strength between the resin polymer and other metals.

[0003] CN103249695A discloses a boron nitride agglomerate, which includes thin layered hexagonal boron nitride primary particles agglomerated with each other in a preferred orientation, the agglomerate is shaped into a sheet, and the sheet-like agglomerate is used for polymerization suitable fillers for the manufacture of polymer-boron nitride composites, and for hot pressing of boron nitride sintered bodies; and figure 1 Compared with flake-shaped boron nitride, the accumulation of flake-shaped boron nitride aggregates is more directional, which will improve dispersion and increase the amount of addition to a certain extent, and improve thermal conductivity, but boron nitride agglomerates The particle size of the compound will be too large, the particle size of the aggregate is difficult to control, and the peel strength is limited.

Although the composite materials disclosed above all have high thermal conductivity, their improvement in peel strength is still insufficient

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