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A sensing film and microelectromechanical device

A micro-electro-mechanical device and sensing film technology, applied in the field of micro-electro-mechanics, can solve the problems of low sensitivity of micro-electro-mechanical devices and inability to accurately control film stress, etc., and achieve the effects of good stress relief, increased deformation, and increased sensitivity.

Active Publication Date: 2019-09-06
SHANDONG GETTOP ACOUSTIC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the material properties of the sensing film determine the sensitivity performance of the component, but the thermal residual stress generated in the semiconductor processing process cannot be avoided
However, the existing process technology is still unable to accurately control the film stress, and the sensitivity of the MEMS device is low

Method used

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  • A sensing film and microelectromechanical device
  • A sensing film and microelectromechanical device
  • A sensing film and microelectromechanical device

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Embodiment Construction

[0036] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present invention and the above drawings are used to distinguish similar objects, and not necessarily Used to describe a specific sequence or sequence. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments described h...

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Abstract

The invention relates to the technical field of micro-electro-mechanical systems, in particular to a sensing film and a micro-electro-mechanical system. The sensing film comprises a stress dispersionpart and a sensing part, the stress dispersion part comprises a plurality of planar vibration springs, each vibration spring comprises a first half spring and a second half spring, and the first halfsprings and the second half springs are connected in a staggered manner. The sensing film is adopted by the micro-electro-mechanical device. The sensing film and the micro-electro-mechanical device have the advantage of being good in stress relieving effect.

Description

technical field [0001] The present invention relates to the field of micro-electromechanical technology, in particular to a sensing film and a micro-electromechanical device. Background technique [0002] The capacitive sensor structure included in the MEMS device is generally a sensing film and a back electrode, forming a two-parallel capacitive plate structure to sense vibration or pressure change. Among them, the material properties of the sensing film determine the sensitivity performance of the component, but the thermal residual stress generated in the semiconductor processing process cannot be avoided. However, the existing process technology is still unable to precisely control the stress of the film, and thus the sensitivity of the MEMS device is low. [0003] Therefore, how to provide a sensing film with a good effect of releasing stress has become a requirement in the prior art. Contents of the invention [0004] In order to overcome the deficiencies of the pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B3/00
CPCB81B3/0021B81B3/0072B81B2201/0221
Inventor 詹竣凯罗松成
Owner SHANDONG GETTOP ACOUSTIC