A damage-resistant high-precision chip inspection device with fixed functions

Abstract

The invention relates to an anti-damage high-precision chip detection device with a fixed function, which includes a base, a controller, a top plate, a fixing mechanism, a supporting mechanism and four legs, and the supporting mechanism includes an air guide box, a fan, a lifting component, and a lifting plate , a detection component and four supporting components, the fixing mechanism includes a fixed block, a first motor, a turntable and four fixing components, the fixing component includes a splint, a moving rod and a transmission unit, the anti-damage high-precision chip testing equipment with a fixing function The chip is easily supported by the support mechanism, which drives the chip to float to the bottom of the fixed block, which reduces the pressure of the top pin on the chip and prevents the chip from being damaged due to excessive pressure. Not only that, the position of the chip is fixed by the fixing mechanism before detection to avoid the chip from happening. The offset sliding ensures the detection accuracy of the equipment and improves the practicability of the equipment.

Description

technical field [0001] The invention relates to the field of chip detection equipment, in particular to an anti-damage high-precision chip detection equipment with fixed functions. Background technique [0002] Integrated Circuit (Integrated Circuit, IC), also known as microchip, chip or chip, is a way of miniaturizing circuits (including semiconductor devices, including passive components, etc.) in electronics, and is often manufactured on semiconductor wafers surface. [0003] With the development of the semiconductor industry, the thickness of integrated circuit chips is becoming thinner and thinner, and the size of chips is becoming more and more diverse. In the process of chip production and processing, chip inspection operations are often required. The existing chip detection equipment mainly places the chip above each thimble, contacts the chip through the thimble, and then cooperates with a series of detection circuits to test the performance of the chip. When testi...

AI Technical Summary

Problems solved by technology

The existing chip detection equipment mainly places the chip above each thimble, contacts the chip through the thimble, and then cooperates with a series of detection circuits to test the performance of the chip. When testing in this way, the chip lacks corresponding fixing devices. The chip is prone to sliding offset, which affects the contact between the thimble and the chip, thereby reducing the detection accuracy of the chip and affecting the detection result of the chip. Not only that, the mutual pressure between the chip and the thimble is relatively high, and the thimble is easy to puncture the surface of the chip. cause damage, further reducing the usefulness of existing chip inspection equipment

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