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Chip-on-board package substrate and manufacturing method thereof, display device, electronic device

A chip packaging and display device technology, applied in the electronic field, can solve problems such as low reflectivity, and achieve the effect of reducing product power consumption

Active Publication Date: 2022-05-17
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing chip-on-board packaging substrate uses aluminum substrate or mirror aluminum as the reflective layer, and its reflectivity is low

Method used

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  • Chip-on-board package substrate and manufacturing method thereof, display device, electronic device
  • Chip-on-board package substrate and manufacturing method thereof, display device, electronic device
  • Chip-on-board package substrate and manufacturing method thereof, display device, electronic device

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Embodiment Construction

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0037] see figure 1 , figure 1 It is a schematic diagram of the first structure of the chip-on-board packaging substrate provided by the embodiment of the present application. Wherein, a Chip On Board (COB) package substrate 100 includes a substrate board 102 , a circuit wiring layer 104 , one or more organic light emitters (LED light-emitting wafers) 108 and a reflective layer 106 .

[0038] The base plate 102 may be polyimide or glass fiber, graphite, copper alloy or other m...

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Abstract

Embodiments of the present application provide a chip-on-board packaging substrate and a manufacturing method thereof, a display device, and an electronic device. The chip-on-board packaging substrate includes a substrate board, a circuit wiring layer, one or more organic light emitting bodies, and a reflective layer; The circuit wiring layer is arranged on the substrate board; each of the organic light-emitting bodies includes a connection end, and the connection end is arranged on the substrate board and is electrically connected to the circuit wiring layer. connection; a reflective layer, the reflective layer covers the circuit wiring layer, the reflective layer surrounds and is connected to the periphery of the connection end, and the reflective layer is used to reflect the optical signal emitted by the organic light emitting body. Maximize the coverage area of ​​the reflective layer, make full use of light energy, and reduce product power consumption.

Description

technical field [0001] The present application relates to the field of electronic technology, in particular to a chip-on-board package substrate and a manufacturing method thereof, a display device, and electronic equipment. Background technique [0002] The existing chip-on-board packaging substrate uses an aluminum substrate or mirror aluminum as a reflective layer, and its reflectivity is low. In the related art, the chip-on-board packaging substrate uses printed white ink as the reflective layer. Contents of the invention [0003] Embodiments of the present application provide a chip-on-board packaging substrate and a manufacturing method thereof, a display device, and an electronic device, which can improve the reflectivity of the chip-on-board packaging substrate. [0004] An embodiment of the present application provides a chip-on-board packaging substrate, which includes: [0005] base plate; [0006] A circuit wiring layer, the circuit wiring layer is arranged ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13357H01L25/04H01L51/52
CPCG02F1/133603G02F1/133605G02F1/133628H10K59/90H10K50/856
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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