Method and system for determining wafer edge die
A judgment method and die technology, applied in image analysis, image enhancement, instruments, etc., can solve problems such as different positions
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Embodiment 1
[0058] After the wafer arrives at the factory, it needs to be cut, and how to cut it has been determined according to the different products. for example Figure 6 , cut into 12 columns in the X direction and 15 columns in the Y direction;
[0059] After cutting, each cut small unit is a die. The individual dies are sent for testing in full break-up order, but the position X and Y of each die on the wafer is recorded along with the die. When testing, we only know the position parameters of each die such as X=2, Y=-3. Therefore, if you want to know where the die is on the wafer, this is very important, because the edge of the wafer The possibility of congenital defects in the die is very high. If the die test fails, it is necessary to decide whether to conduct further investigation based on its position on the wafer. Wafer map to decide.
[0060] This wafer edge die determination method is a method to calculate whether a die is at the edge of the wafer. The definition of th...
Embodiment 2
[0068] This embodiment discloses a figure 1 In the wafer edge die determination method shown, on the basis of Embodiment 1, further, in the wafer division S2, the number of columns at both ends in the X direction is set to be X min , X max , and the number of columns at both ends in the Y direction is Y min , Y max , and the position of each die on the wafer map is (X, Y), where X min ≦X≦X max , and Y min ≦Y≦Y max , the values of X and Y are both integers (including positive and negative integers).
[0069] Since the wafer has been divided and the position of the die has been disturbed during the inspection of the use of the die, it is impossible to determine where the die is originally located on the wafer and whether it is a die on the edge of the wafer through the method of restoring and comparing the wafer map. core, and the wafer itself is also limited by factors such as processing level, it is difficult to form a perfect circle, but the die itself belongs to pre...
Embodiment 3
[0077] This embodiment discloses a figure 1 The shown wafer edge die judgment method, on the basis of Embodiments 1 and 2, further, the die eigenvalue constant P is 0.7; the wafer edge eigenvalue constant E is 0.02, and the die judgment is set The value is A, A=R (X，Y) -M, wherein M is a constant of edge judgment feature value and M=0.98;
[0078] When the die position is determined in S4, substitute the position (X, Y) of the die to be determined, the position of the center die (X 0 ,Y 0 ) and X-axis eigenvalue a, Y-axis eigenvalue b, die eigenvalue constant P and wafer edge eigenvalue constant E;
[0079]
[0080] Calculate the result A;
[0081] If A>0, it is determined that the defective die is located at the edge of the wafer; if A≦0, it is determined that the defective die is located within the wafer.
[0082] This wafer edge die judgment method uses a formulaic technical method to directly give the judgment result of whether the die belongs to the wafer edge pos...
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