Device and method for controlling multi-die power module

Abstract

The present invention concerns a method for controlling the temperature of a multi-die power module, the method comprising the steps of: - determining a first weighted arithmetic mean of junction temperatures of the dies of the multi-die power module and memorizing the weighted arithmetic mean, - determining successively another weighted arithmetic mean of junction temperatures of the dies, - checking if the difference between the other weighted arithmetic mean and the memorized weighted arithmetic mean is lower than a first redetermined value, - enabling a modification of the duty cycle of aninput signal to apply to at least one selected die of the multi-die power module if the difference between the other weighted arithmetic mean and the memorized weighted arithmetic mean is lower thana first predetermined value, - disabling a modification of the duty cycle of the input signal to apply to the at least one die of the multi-die power module if the difference between the other weighted arithmetic mean and the memorized weighted arithmetic mean is not lower than the first predetermined value.

Description

technical field [0001] The present invention generally relates to apparatus and methods for controlling the temperature of a multi-die power module. Background technique [0002] Due to limitations in the semiconductor manufacturing process, there is a practical limit to the total semiconductor area of ​​a single power die. Therefore, high power modules usually contain multiple dies connected in parallel to achieve a given rated current. [0003] However, the temperature distribution within a group of dies is usually non-uniform due to non-ideal constraints on geometric and electrical parameter variations. As a result, the hottest die limits the total amount of power that the module can dissipate, and the uneven temperature distribution causes uneven aging of the individual dies, limiting the effectiveness of using parallel arrangements. Contents of the invention [0004] It is an object of the present invention to reliably control the temperature of a multi-die power mo...

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Problems solved by technology

[0003] However, the temperature distribution within a group of dies is usually non-uniform due to non-ideal constraints on geometric and electrical parameter variations

As a result, the hottest die limits the total amount of power the module can dissipate, and the uneven temperature distribution causes uneven aging of the individual dies, limiting the effectiveness of using paralleled arrangements

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