Soldering flux composition, soldering flux composition and electronic substrate

A composition and flux technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problem of stickiness of flux residues, and achieve the effect of inhibiting stickiness and cracking

Inactive Publication Date: 2019-08-06
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in such a case, there is a problem that the flux residue tends to be sticky

Method used

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  • Soldering flux composition, soldering flux composition and electronic substrate
  • Soldering flux composition, soldering flux composition and electronic substrate
  • Soldering flux composition, soldering flux composition and electronic substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] 34% by mass of rosin-based resin A, 10% by mass of rosin ester, 4% by mass of activator A, 3% by mass of activator B, 5% by mass of activator C, 0.5% by mass of activator D, 0.5% by mass of activator E, 23% by mass of solvent A, 10% by mass of solvent B, 3% by mass of thixotropic agent A, 2% by mass of thixotropic agent B, 1% by mass of thixotropic agent C, 2% by mass of antioxidant A, and 2% by mass of antioxidant B It was thrown into a container, mixed using a planetary mixer, and obtained a flux composition.

[0093] Then, 11% by mass of the obtained flux composition and 89% by mass of the solder powder (100% by mass in total) were put into a container and mixed with a planetary mixer to prepare a solder composition. The viscosity (measurement temperature: 25° C.) of this solder composition was 210 Pa·s, and the thixotropic index was 0.580.

Embodiment 2～4

[0095] A flux composition and a solder composition were obtained in the same manner as in Example 1 except that each material was blended in the composition shown in Table 1.

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Abstract

This flux composition contains (A) a rosin-based resin, (B) an activator, (C) a solvent, and (D) a thixotropic agent, and wherein: the component (A) contains (A1) a rosin-based resin having an acid value of 200 mgKOH / g or more and (A2) a rosin ester having an acid value of 50 mgKOH / g or less.

Description

technical field [0001] The present invention relates to a flux composition, a solder composition and an electronic substrate. Background technique [0002] The solder composition is a mixture obtained by kneading a flux composition (rosin-based resin, activator, solvent, etc.) with solder powder to form a paste (for example, Document 1 (JP-A-2013-82004)). In this solder composition, solderability such as solder meltability and properties such as solder wetting and spreading (solder wetting and spreading) are required, and at the same time, suppression of solder balls, heating drips and voids, printability, and the like are required. [0003] In addition, as a solder composition, a so-called no-clean type solder composition in which flux residue remains as it is is widely used. [0004] When soldering electronic components using a solder composition, cracks are generated by the flux residues in the junction of the electronic components after reflow. It should be noted that ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362B23K35/36
CPCB23K35/3612B23K35/3618B23K35/362
Inventor 神奈津希田中谦太
Owner TAMURA KK
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