High-strength electrolytic copper foil and various products using the same
An electrolytic copper foil, high-strength technology, applied in the direction of electrolytic process, electroforming, circuit, etc., can solve the problem of not being able to provide ultra-thin copper foil that meets the strength requirements
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[0054] Please refer to Figure 7 , the present invention also provides a preparation method of electrolytic copper foil, comprising the following steps:
[0055] S4, copper sulfate electrolyte configuration: heat and dissolve high-purity copper wires with a purity of 99.95% and above in sulfuric acid solution to generate copper sulfate electrolyte;
[0056] S5, raw foil manufacturing; add additives to the copper sulfate electrolyte, and transport it to the electrolytic cell of the foil machine for electrolytic raw foil, wherein; the process parameters of electrolytic raw foil are: the temperature of the electrolytic solution is controlled at 50-60 °C, the current density of the anode plate 12 during the foil production process is 38-45A / dm 2 , Cu 2+ Concentration is 90~95g / L, H 2 SO 4 Concentration is 100-110g / L, gelatin concentration is 100-300ppm, ceric sulfate concentration is 0.5-10ppm, MESS concentration is 1-20ppm, SPS concentration is 10-50ppm, Cl - The concentrati...
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[0069] Example: heating and dissolving a high-purity copper wire with a purity of 99.95% in a sulfuric acid solution to form a copper sulfate electrolyte; adding additives to the copper sulfate electrolyte, and transporting it to the electrolytic cell of a foil production machine for electrolytic foil production. Among them; the process parameters of electrolytic raw foil are: the temperature of the electrolyte is controlled at 58 ° C, Cu 2+ Concentration is 94g / L, H 2 SO 4 Concentration is 106g / L, gelatin concentration is 150ppm, ceric sulfate concentration is 4ppm, MESS concentration is 12ppm, SPS concentration is 25ppm, Cl - The concentration is 28ppm; copper foils of 4 microns, 4.5 microns, 5 microns and 6 microns are respectively obtained by controlling the current density of the anode plate during the foil production process. The test data of various copper foils are as follows:
[0070]
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