Transfer device and manufacturing method of display substrate

A technology for transferring devices and display substrates, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc. It can solve the problems of low manufacturing yield of display substrates, achieve the effect of simplifying the manufacturing process and improving the manufacturing yield

Inactive Publication Date: 2019-08-06
BOE TECH GRP CO LTD +1
View PDF15 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present invention provides a transfer device and a method for manufacturing a display substrate, so as to solve the problem of low manufacturing yield of the existing method for manufacturing a display substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Transfer device and manufacturing method of display substrate
  • Transfer device and manufacturing method of display substrate
  • Transfer device and manufacturing method of display substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0036] see figure 1 , the embodiment of the present invention provides a transfer device 1, comprising: a transparent carrier 11; one side surface of the transparent carrier 11 is provided with a plurality of adhesive parts 12 arranged at intervals, and the adhesive parts 12 adopt photosensitive Adhesive material; the other side surface of the transparent carrier 11 is provided with a plurality of opaque patterns 131, and the orthographic projection of the gap between the opaque patterns 131 on the transparent carrier 11 is related to the adhesive portion The orthographic projections of 12 on the transparent carrier 11 overlap.

[0037] In the embodiment of the present invention, the adhesive part 12 is a photosensitive adhesive material. When the adhes...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The embodiment of the invention provides a transfer device and a manufacturing method of a display substrate. The transfer device comprises a transparent carrier. Multiple adhesion parts distributed at intervals are arranged on the surface of one side of the transparent carrier, and the adhesion parts are made of a photosensitive viscous material. Through the transfer device provided by the embodiment of the invention, the manufacturing process of the display substrate can be simplified, and the manufacturing yield can be improved.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display, in particular to a transfer device and a manufacturing method of a display substrate. Background technique [0002] In the process of making Micro LED (light-emitting diode) chips into display devices, it is usually necessary to transfer a large number (millions) of Micro LED chips to the driving substrate to form an LED array. Due to the small size of Micro LED chips, it is difficult to accurately align them. , During the transfer process, it is easy to fail to successfully connect with the driving substrate, resulting in dead pixels and reducing the manufacturing yield. Contents of the invention [0003] Embodiments of the present invention provide a transfer device and a method for manufacturing a display substrate, so as to solve the problem of low manufacturing yield of the existing method for manufacturing a display substrate. [0004] In a first aspect, an embodiment of t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L21/67H01L25/075
CPCH01L21/67132H01L25/0753H01L33/0095
Inventor 查长军刘超彭元鸿曾娅魏雄周黎敏
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap