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Integrated package display module

A display module, integrated packaging technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of color stability changes, difficult to control coating uniformity, inconvenient maintenance, etc., to reduce color differences and improve contrast. effect of effect

Inactive Publication Date: 2019-08-06
UNILUMIN GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The coating uniformity of this method is difficult to control, and non-similar materials are prone to problems such as peeling off and color stability changes under the continuous action of light and heat during long-term use, and the feasibility is not high, and maintenance is inconvenient

Method used

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Experimental program
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Effect test

Embodiment 1

[0029] Please refer to figure 1 Embodiment one of the present invention is:

[0030] An LED display module, comprising a driver 1, a PCB board 2, an LED chip 3, a transparent adhesive layer 4 and a translucent adhesive layer 5 mixed with black powder, the driver 1, the PCB board 2, the LED chip 3 and the transparent adhesive Layers 4 are arranged in sequence, the transparent adhesive layer 4 wraps the LED chip 3, the number of layers of the translucent adhesive layer 5 is at least one layer, and the translucent adhesive layer 5 is arranged on the side of the transparent adhesive layer 4 away from the LED chip 3 superior.

[0031] The translucent adhesive layer 5 covers the entire PCB 2 , and the transparent adhesive layer 4 and the translucent adhesive layer 5 are made of the same material. The materials of the transparent adhesive layer 4 and the translucent adhesive layer 5 are respectively epoxy resin, silicone resin, silica gel or UV glue.

[0032] The material of the m...

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PUM

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Abstract

The invention provides an integrated package display module with high contrast and uniform color among modules. The integrated package display module comprises a driver, a PCB, an LED chip, a transparent adhesive layer and a translucent adhesive layer doped with black powder. The driver, the PCB, the LED chip and the transparent adhesive layer are arranged in turn. The translucent adhesive layer is located on one side of the LED chip away from the PCB, and covers the entire PCB.

Description

technical field [0001] The invention relates to the technical field of LED display screens, in particular to an integrated packaging display module. Background technique [0002] With the development of indoor small-pitch LED display technology, in order to achieve smaller pixel pitch and higher reliability requirements, integrated packaging indoor small-pitch LED display products have emerged as the times require. Integrated packaging technology is a product that directly encapsulates LED chips on the LED driver board, eliminating the need for SMD packaging reflow links, and adopting one-time overall packaging technology to achieve integration. It has the technical characteristics of simple structure, easy realization of high density, high reliability, and low packaging cost. Once the product came out, it has received widespread attention from the industry. However, due to the dense wiring on the surface of the high-density packaging substrate and the arrangement of LED c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L25/16
CPCH01L25/167H01L33/56H01L2933/005
Inventor 孙天鹏张金刚
Owner UNILUMIN GRP
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