Flexural fatigue resistant ribbon transmission line and manufacturing process thereof
A strip transmission line, flexural fatigue technology, applied in the direction of printed circuit parts, electrical components, printed circuits, etc., to achieve the effect of high flexural fatigue resistance
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Embodiment 1
[0025] reference figure 1 with figure 2 , A flexural fatigue resistant belt-shaped transmission line, comprising an upper protective film 1, an upper ground layer 2, an upper composite metal layer 3, an upper insulating dielectric layer 4, a middle composite metal layer 5, a lower insulating dielectric layer 6, and a lower composite metal layer 7. Lower ground layer 8 and lower protective film 9, upper protective film 1, upper ground layer 2, upper composite metal layer 3, upper insulating dielectric layer 4, middle composite metal layer 5, lower insulating dielectric layer 6, lower composite metal layer 7. The lower ground layer 8 and the lower protective film 9 are sequentially laminated in order to form a belt-shaped transmission line. A metal circuit is formed on the middle composite metal layer 5, and the metal circuit includes a high-frequency signal line 14, a ground layer 15, a high-speed signal line 16 and a ground line 17. The upper insulating dielectric layer 4 and...
Embodiment 2
[0035] reference figure 1 with figure 2 , A process for manufacturing a flex fatigue-resistant ribbon transmission line, including the following steps:
[0036] S1. Provide a medium composite metal layer 5 with a ground layer 15, a high-frequency signal line 14, a high-speed signal line 16 and a ground line 17;
[0037] S2. First use glue or low melting point PEEK film to connect one side of the lower insulating dielectric layer 6 and the middle composite metal layer 5 into a whole by hot pressing, and the upper insulating dielectric layer 4 and the other side of the middle composite metal layer 5 are heated. Compression-connected into one body, the middle composite metal layer 5 is covered;
[0038] S3. Select laser ablation of the set positions of the upper insulating dielectric layer 4 and the lower insulating dielectric layer 6 to form the via hole 10, and clean the via hole 10 with plasma;
[0039] S4. The other side of the upper insulating dielectric layer 4 is first covered w...
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