A strip transmission line with high resistance to flex fatigue and its manufacturing method
A strip transmission line, high flex resistance technology, applied in printed circuit manufacturing, manufacturing printed circuit precursors, removing conductive materials by chemical/electrolytic methods, etc., to achieve small side erosion, excellent bending resistance, nickel-copper Good etching effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0038] Please refer to figure 1 , a strip transmission line with high resistance to flex fatigue, including an upper structure, an intermediate structure, and a lower structure, the upper structure and the lower structure are symmetrically laminated with the intermediate structure, and the overlapping parts of the intermediate structure, the upper structure, and the lower structure are non- Flexure zone A, the non-overlapping part is flexure zone B, the upper layer structure includes the laminated first insulating protection layer 1 and the first nickel-copper composite metal layer 2, and the lower layer structure includes the laminated fourth insulating protection layer 14 and the first Five-nickel-copper composite metal layer 13, the middle layer structure includes the second insulating protection layer 3, the second nickel-copper composite metal layer 5, the first insulating dielectric layer 6, the third nickel-copper composite metal layer 7, the second Insulation dielectri...
Embodiment 2
[0051] Please refer to figure 1 , a high flex fatigue resistance strip transmission line manufacturing method, including:
[0052] S1. First, a layer of nickel layer with a thickness of more than ten nanometers is made on one side of the high-melting point single-layer PEEK film by nickel ion implantation, and a 5-9um thick copper layer is electroplated on the nickel layer to form a third nickel-copper layer. Composite metal layer 7, the third nickel-copper composite metal layer 7 forms a metal circuit through dry film pasting, exposure, development, and etching;
[0053] S2. First use the second bonding layer 8 to hot press the second insulating dielectric layer 9 side to the third nickel-copper composite metal layer 7 side, and hot-press the first insulating dielectric layer 6 side to the third nickel-copper composite metal layer On the other side of the layer 7, the third nickel-copper composite metal layer 7 is coated therein;
[0054] S3. Using a laser to ablate the set...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 
