A flex fatigue resistant ribbon transmission line and its manufacturing process
A strip transmission line, flex fatigue technology, applied in the direction of printed circuit components, printed circuits, electrical components, etc., to achieve high flex fatigue resistance effect
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Embodiment 1
[0025] refer to figure 1 and figure 2 , a strip transmission line resistant to flex fatigue, comprising an upper protective film 1, an upper ground layer 2, an upper composite metal layer 3, an upper insulating dielectric layer 4, a middle composite metal layer 5, a lower insulating dielectric layer 6, and a lower composite metal layer 7. Lower ground layer 8 and lower protective film 9, upper protective film 1, upper ground layer 2, upper composite metal layer 3, upper insulating dielectric layer 4, middle composite metal layer 5, lower insulating dielectric layer 6, lower composite metal layer 7. The lower ground layer 8 and the lower protective film 9 are sequentially laminated to form a strip transmission line. A metal line is formed on the middle composite metal layer 5 , and the metal line includes a high-frequency signal line 14 , a ground layer 15 , a high-speed signal line 16 and a ground line 17 . The upper insulating dielectric layer 4 and the lower insulating di...
Embodiment 2
[0035] refer to figure 1 and figure 2 , a flex fatigue resistant ribbon transmission line manufacturing process, comprising the following steps:
[0036] S1. Provide a middle composite metal layer 5 with a ground layer 15, a high-frequency signal line 14, a high-speed signal line 16 and a ground line 17;
[0037] S2. First use glue or low-melting point PEEK film to connect one side of the lower insulating medium layer 6 and one side of the middle composite metal layer 5 into one body by thermal compression, and one side of the upper insulating medium layer 4 and the other side of the middle composite metal layer 5 are heated. crimped and connected into one body, and the middle composite metal layer 5 is covered therein;
[0038] S3. Selecting the set positions of the upper insulating dielectric layer 4 and the lower insulating dielectric layer 6 by laser ablation to form a via hole 10, and cleaning the via hole 10 with plasma;
[0039] S4. The other side of the upper insulat...
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