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Holding surface grinding method

A surface-holding and grinding technology, which is applied in the direction of optical surface grinders, grinding machine parts, grinding/polishing equipment, etc., can solve problems such as wafer thinning

Active Publication Date: 2019-08-16
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the case of a thick wafer held by the holding table, the wafer cannot follow the shape of the holding surface but a gap is created near the apex of the conical surface of the holding surface (that is, between the holding surface and the central lower surface of the wafer) , there is a problem that the center of the wafer is thinned due to excessive grinding

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Examples

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Embodiment Construction

[0018] figure 1 It is an example of the grinding apparatus 1 using the grinding method of the holding surface of this invention. The grinding apparatus 1 has at least: a grinding unit 10 that rotates around a rotating shaft 100 that passes through the center of the grinding wheel 13; and a holding unit 20 that allows the holding table 21 to pass through the holding surface for holding the wafer. The rotation shaft 200 at the center of 24a rotates around.

[0019] Grinding unit 10 has: main shaft 11, and it has the axle center of vertical direction; Grinding grinding wheel 13, it is installed on the lower end of main shaft 11 by mounting seat 12; The lower part of 13. The grinding unit 10 is connected to a lift unit 18 that vertically lifts the grinding unit 10 , and is connected to a motor (not shown) that rotates the main shaft 11 .

[0020] Grinding stone 14 is a vitrified grinding stone obtained by mixing vitrified bond 15 and diamond abrasive grains 16 and sintering the...

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Abstract

Provided is a grinding method for providing a holding surface, which can perform holding by a holding table so that the center of a ground wafer is not thinned. In the grinding method of the holding surface, a used grinding abrasive tool (14) is a ceramic abrasive tool having pores (17) on a grinding surface (14a) obtained by mixing a ceramic binder (15) with diamond abrasive grains (16) and sintering them to be solidified. The ceramic grinding tool is formed in a ring shape and has no gap on the grinding surface, the holding table (21) is rotated to bring the grinding surface into contact with the radius region of the holding surface (24a) then, and then the holding surface is grounded, so it is possible to grind the holding surface while embedding the diamond abrasive grains in the poresof the grinding surface in the radius region and to form a concave portion (25) in the center of the holding surface by the diamond abrasive grains extruded from the pores of the grinding surface when a gap is formed between the grinding surface and the holding surface by passing through the center (C) of the holding surface, and then the wafer can be held by the holding surface without the gap,and the wafer can be ground to a uniform thickness.

Description

technical field [0001] The present invention relates to a grinding method for grinding a holding surface of a holding table. Background technique [0002] A grinding apparatus for grinding a wafer has: a holding table, which holds the wafer; A grinding tool that grinds a wafer on a table so that the wafer can be ground to a predetermined thickness. In the grinding device, after the grinding wheel or the holding table is replaced, etc., in order to make the holding surface of the holding table parallel to the grinding surface of the grinding wheel, the holding surface is carried out by using the grinding wheel. Grinding self-grinding (for example, refer to the following Patent Document 1). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2014-237210 [0004] In the self-grinding described above, grinding is performed by bringing the grinding surface of the grinding wheel into contact with the radius range of the holding table, so the holding surface of the holding...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B13/01
CPCB24B1/00B24B13/01B24B53/017B24B37/34B24D3/10
Inventor 长井健木川有希子掛札将树
Owner DISCO CORP
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