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Preparation method of display substrate, display substrate and display device

A technology of display substrate and display area, applied in branch equipment, organic semiconductor devices, semiconductor devices, etc., can solve the problems of lower reliability of display products, more holes in the display area, and packaging failure.

Active Publication Date: 2019-08-23
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]However, there are many difficulties in the technology of punching holes in the display area
For example, when cutting the display area, it is easy to generate cracks, and the cracks are easy to extend to the effective display area in the subsequent process, causing package failure and reducing the reliability of display products.

Method used

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  • Preparation method of display substrate, display substrate and display device
  • Preparation method of display substrate, display substrate and display device
  • Preparation method of display substrate, display substrate and display device

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Embodiment Construction

[0029] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0030] The inventors found that, in order to punch a hole in the display area, the crack formed during the cutting process is related to the thickness of the inorganic layer at the cutting edge. In the process of depositing the film layer, masks such as CVD (Chemical Vapor Deposition, Chemical Vapor Deposition) Mask cannot support and block the perforated area, so the inorganic film layer deposited by CVD will extend from the effective display area to the hole. The cutting edge increases the thickness of the inorganic film layer on the cutting edge, which makes it easy to generate cracks during the cutting process, and then the cracks extend to the effective display area in the subsequent process, resulting in package failure.

[...

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Abstract

The invention provides a preparation method of a display substrate, the display substrate and a display device. The display substrate comprises an effective display region, a perforated region and a critical region arranged between the effective display region and the perforated region. The display substrate of the critical region comprises a substrate and at least one first barrier wall which isarranged on the substrate. The first barrier walls are separately arranged. Each first barrier wall comprises a metal layer and an insulating layer which are laminated and each first barrier wall protrudes out of the substrate surface. The first barrier walls protruding out of the substrate surface are arranged in the critical region, and the undulation formed by the first barrier walls on the substrate surface can block the propagation of Crack and block Crack from extending to the effective display region so that the reliability of the display product can be improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for preparing a display substrate, a display substrate and a display device. Background technique [0002] At present, almost all mobile phone cameras on the market are placed above the screen. Because the camera has a certain size, it often occupies a large frame on the whole phone, which seriously affects the screen-to-body ratio. As the mobile phone market favors full-screen mobile phones, products that punch holes in the display area and place cameras in the hole area are born. [0003] However, there are many difficulties in the technology of punching holes in the display area. For example, cracks are likely to be generated when the display area is cut, and the cracks are likely to extend to the effective display area in the subsequent process, causing package failure and reducing the reliability of the display product. Contents of the invention [0004] The in...

Claims

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Application Information

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IPC IPC(8): H01L27/32
CPCH10K59/122H10K59/8731H04M1/0264H04M1/0266H10K59/124H10K59/1213H10K2102/351H10K71/00
Inventor 赵攀蒋志亮王格
Owner BOE TECH GRP CO LTD
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