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Encapsulated wearable device and system with increased surface energy

A wearable device and encapsulation layer technology, which can be used in devices introduced into the body, medical science, diagnosis, etc., and can solve problems such as hindering the cleaning and removal of adhesive components

Inactive Publication Date: 2019-08-23
美谛达解决方案公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the strength of the adhesive of the adhesive layer can be increased, this can create problems that prevent clean removal of the replaceable adhesive element for reuse of the wearable device

Method used

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  • Encapsulated wearable device and system with increased surface energy
  • Encapsulated wearable device and system with increased surface energy
  • Encapsulated wearable device and system with increased surface energy

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Embodiment Construction

[0019] While this disclosure includes certain exemplary embodiments, it should be understood that this disclosure is not limited to those particular embodiments. On the contrary, the present disclosure is intended to cover all alternatives, modifications and equivalent arrangements, which may be included within the spirit and scope of the present disclosure as further defined by the appended claims.

[0020] The present disclosure relates to a polymer matrix (eg, coating) that can be applied to an encapsulated device to modify the properties of the outer surface of the encapsulation material. For example, a polymer matrix coating can be used to make the encapsulation material less tacky or reduce its coefficient of friction to help prevent accidental or accidental removal of the device due to contact with clothing and external objects or surfaces. The polymer matrix may further assist in adhering removable adhesive elements such as adhesive layers, patches, stickers, etc. to t...

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Abstract

Aspects of the present disclosure include a polymer matrix that is formed on a wearable device to increase the surface energy and reduce the tackiness of the surface of the wearable device. The present disclose includes a wearable device that can be worn on a user, such as one the user's skin. The device includes one or more electronic components and an encapsulation layer surrounding the one or more electronic components. The device further includes a polymer matrix at least partially covering a first side of the wearable device. The polymer matrix has a higher surface energy than the encapsulation layer so as to improve adhesion with an adhesive layer. The present disclosure also includes a wearable device system that further includes the adhesive layer.

Description

[0001] Cross References to Related Applications [0002] This application claims priority and benefit to U.S. Provisional Application No. 62 / 422,340, entitled "Encapsulated Wearable Devices and Systems with Increased Surface Energy," filed November 15, 2016, the entire contents of which Incorporated herein by reference. technical field [0003] The present disclosure relates to a packaging device. In particular, the present disclosure relates to improving adhesion between an adhesive element and a packaged device, such as a wearable electronic device. Background technique [0004] As the cost of manufacturing electronic devices decreases, these electronic devices are becoming more and more common. Similarly, as various improvements have been made to reduce the size of various internal components, electronic devices have become smaller and smaller in size and shape. These improvements allow the expansion of electronic devices into many different fields and applications. O...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B5/00A61B5/04A61B5/0408A61M5/00A61M5/14A61M5/142
CPCA61B5/6833A61M5/00A61M5/142A61B5/24A61B5/6801
Inventor 丹尼尔·戴维斯戴维德·加洛克史蒂文·法斯特尔特
Owner 美谛达解决方案公司