A post-processing method for copper clad laminate

Abstract

The invention provides a copper-clad plate forming post-processing method. The method is completed by matching a die frame, a middle grinding block, two end grinding blocks and two chamfering dies. According to the method, the following problems can be solved: 1, when deburring is needed, a person usually uses sandpaper to directly make contact with the side wall of a copper-clad plate so as to polish, and when polishing, the heads of burrs at the upper end and the lower end of the side edge of the copper-clad plate are offset to the outside due to extrusion of the sandpaper that the burrs atthe part are difficult to completely remove by the sandpaper; 2, the copper-clad plate is formed by laminating two copper foil surface layers and a resin core therebetween, and the side edges of the core layer might be damaged to a certain extent when the sandpaper is adopted to dry sand the core layer to remove the burrs; and 3, after the burrs of the copper-clad plate are removed, the copper-clad plate needs to be subjected to chamfer polishing through the sandpaper, but the chamfer polishing treatment of the copper-clad plate is difficult to complete manually due to the fact that the copper-clad plate is thin.

Description

technical field [0001] The invention relates to the field of post-treatment of copper-clad laminates, in particular to a method for post-processing of copper-clad laminates. Background technique [0002] Copper-clad laminate is a hot-pressed plate-like material, which is the basic material for PCB. The copper-clad laminate needs to be cut during manufacturing and molding. There are burrs on the side of the cut copper-clad laminate. Personnel usually use sandpaper to clean it Grinding and deburring the side, however, the following problems often exist in the sanding process: [0003] 1. The copper clad laminate is composed of two copper foil surface layers and a resin core layer in the middle. The core layer is dry-grinded and deburred with sandpaper, which may cause certain damage to the side of the core layer; [0004] 2. Personnel usually use sandpaper to directly contact the side wall of the copper-clad laminate to polish it. During grinding, the heads of the burrs at th...

AI Technical Summary

Problems solved by technology

[0006] In order to solve the above problems, the present invention provides a post-processing method for copper-clad laminates, which can solve the problem that when deburring, personnel usually use sandpaper to directly contact the side walls of the copper-clad laminates to polish them. The heads of the burrs at both ends are extruded by the sandpaper, causing the heads of the burrs at both ends to shift outwards. It is difficult for the sandpaper to completely remove this part of the burrs, and the copper clad laminate is laminated by two copper foil surfaces and a resin core in the middle. Sandpaper is used to dry-grind and deburr the core layer, which may cause certain damage to the side of the core layer. After removing the burrs of the copper clad laminate, it is necessary to chamfer the copper clad laminate with sandpaper, because the thickness of the copper clad laminate is thin , it is difficult to complete the chamfering of the copper clad laminate by manual means

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