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High Resolution Thermopile Infrared Sensor Array

A technology of infrared sensors and sensor arrays, applied in the direction of electric radiation detectors, instruments, TVs, etc., can solve problems such as heating of hot contacts

Active Publication Date: 2021-07-20
HEIMANN SENSOR GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0029] However, this high power loss presents the following disadvantages in thermopile infrared sensor arrays:
On the other hand, heat radiation or heat conduction through the gaseous medium can also cause heating of the thermal contacts

Method used

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  • High Resolution Thermopile Infrared Sensor Array
  • High Resolution Thermopile Infrared Sensor Array
  • High Resolution Thermopile Infrared Sensor Array

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Embodiment Construction

[0058] From figure 1 , 2 It can be seen that according to the basic structure of the thermopile infrared sensor array of the present invention, a matrix-form thermopile infrared sensor array TPA is arranged in the center of the sensor chip, with m x n pixels SE 1.1...SE 1.nx SE ml.1. ..SE m,n. Around the pixel SE or around the pixel field, m x(n / 2) / a signal processing channel K 1 ...K N Preferably located on both sides of the same sensor chip SP for amplifying and filtering the signal of a single pixel SE and converting it into a digital signal. Here multiple pixels a share the signal processing channel K 1 ...K N .

[0059] In principle, all signal processing channels K 1 ...K N Can be located on one side of the pixel field, where the thermopile infrared sensor array has an asymmetric thermal distribution.

[0060] The key to the function of thermopiles is that they have "hot" and "cold" contacts, the contacts are connected to each other by the longest possible condu...

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Abstract

A high-resolution thermopile infrared sensor array having multiple parallel signal processing channels for signals from the sensor array and a digital port for serially transmitting signals, wherein each signal processing channel includes at least one analog-to-digital converter, each Each signal processing channel is allocated a memory area in the memory for storing the results of the analog-to-digital converter. Infrared sensor arrays with particularly high pixel counts should consume as little power as possible at high signal resolutions. This can be achieved by having no more than 8 or 16 pixels (SE) connected to signal processing lanes (K 1 ...K N ), signal processing channel (K 1 ...K N ) is equivalent to at least 4 times the number of rows; some signal processing channels (K 1 ...K N ) are located in the intermediate space between pixels (SE), and other signal processing channels (K 1 ...K N ) together with other electronics are placed in the outer edge area of ​​the sensor chip (SP) around the sensor array (TPA); the cutoff frequency of each low-pass filter (TPF) is at most the frame rate of the thermopile infrared sensor array (TPA) and the number of pixels per signal processing channel (K 1 ...K N ), and the center-to-center distance of the pixels (SE) is less than 200 μm.

Description

technical field [0001] The present invention relates to a high resolution thermopile infrared sensor array having at least 16 rows and at least 16 columns and monolithically integrated signal processing on the sensor chip, multiple parallel signal processing channels for the signals of the sensor array, and Digital ports for serial output of pixel signals, each signal processing channel has at least one analog / digital converter and a low-pass filter, and a memory area allocated to each signal processing channel in the memory for Stores the result of the analog / digital converter. Background technique [0002] To build a high-resolution infrared thermopile sensor array, the number of individual thermopile elements (ie, the number of pixels) must increase, and the geometric size of the pixels themselves must decrease. Initially available thermopile sensor arrays on the market had only a few pixels on them (e.g. 8x8 pixels or 16x16 pixels), where individual pixels were quite la...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01J5/08G01J5/12H04N5/33H04N5/378
CPCG01J5/12G01J5/0803H04N23/23G01J5/0881H04N25/76G01J5/0831G01J5/0884H04N5/33H04N25/75
Inventor J·希福尔戴克B·弗尔格M·施诺尔K·施托克W·莱纳克M·西蒙
Owner HEIMANN SENSOR GMBH