Electronic component pin lead cutting device

Abstract

The invention discloses an electronic component pin lead cutting device which comprises a worktable face. A portal frame is fixed to the left end of the worktable face. First electric telescopic rods and second electric telescopic rods are fixed to the bottom of a cross beam of the portal frame. A limiting plate is fixed to the bottoms of the first electric telescopic rods, and lead through holes are formed in the limiting plate. A bottom plate is fixed to the bottoms of the second electric telescopic rods. The bottom plate is provided with electronic component containing through holes matched with the lead through holes. By means of the electronic component pin lead cutting device, due to the fact that a scraping plate, screw rod sleeves, screw rods, first bearing seats, first bevel gears, second bevel gears, a rotating shaft, a first motor, a second bearing seat, a draught fan, an air cover and a waste chip through hole are arranged, the problems that a traditional electronic component pin lead cutting device cannot be used for removing lead waste chips in time, consequently pin leads which are cut off fall into the electronic component containing through holes, placement of electronic components is not flat, and the cutting precision is affected are solved.

Description

technical field [0001] The invention relates to the technical field of production equipment of electronic components, in particular to a device for cutting pins and leads of electronic components. Background technique [0002] Electronic components are basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with specific functions. In order to maintain the stability of electronic components , they are usually packaged with synthetic resin to improve insulation and protection from environmental influences. After the electronic components are soldered with solder pads, there will be redundant pins, but the traditional electronic component pin lead cutting device cannot be timely Clean up the lead waste, so that the cut lead wires fall into the through holes where the electronic components are placed, resulting in uneven placement of th...

AI Technical Summary

Problems solved by technology

[0008] Aiming at the deficiencies of the prior art, the present invention provides a device for cutting pins and leads of electronic components, which solves the problem that the traditional cutting device for pins and leads of electronic components cannot clean up the scraps of leads in time, so that the cut leads fall off. Insert electronic components into the through hole, resulting in uneven placement of electronic components and affecting the cutting accuracy

Images