Electronic component pin lead cutting device
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 马鞍山秉信光电科技有限公司
- Publication Date
- 2019-09-20
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the technical field of production equipment of electronic components, in particular to a device for cutting pins and leads of electronic components. Background technique
[0002] Electronic components are basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with specific functions. In order to maintain the stability of electronic components , they are usually packaged with synthetic resin to improve insulation and protection from environmental influences. After the electronic components are soldered with solder pads, there will be redundant pins, but the traditional electronic component pin lead cutting device cannot be timely Clean up the lead waste, so that the cut lead wires fall into the through holes where the electronic components are placed, resulting in uneven placement of th...