Integrated circuit chip packaging structure for peripheral equipment
A chip packaging structure, integrated circuit technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of low radiation heat dissipation efficiency, weak welding pin welding, etc.
Active Publication Date: 2020-10-23
GUANGDONG GOPOD GRP HLDG CO LTD
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Problems solved by technology
[0005] Aiming at the deficiencies of the prior art, the present invention provides an integrated circuit chip packaging structure for peripheral equipment, which is equipped with a spring-type cooling device that can effectively dissipate heat from the chip, and a compression-type buckle device that can ensure that the chip as a whole is firmly connected to the circuit board. Realize the advantages of effective welding, etc., and solve the problems of low radiation heat dissipation efficiency of the common chip package structure, and the welding pins are prone to unreliable welding.
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[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0024] see Figure 2-4 , an integrated circuit chip packaging structure for peripheral equipment, including a substrate 1, an adhesive 101, a chip 102, a lead 103, a pin 104, an epoxy resin 2, a circuit board 3 and a through hole 301, and the left and right sides of the pin 104 The sides are fixedly equipped with bumps 105, and the total width of the bumps 105 and the pins 104 is slightly larger than the diameter of the through hole 301, which acts as a limite...
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The invention relates to the field of chip packaging technology, and discloses a peripheral integrated circuit chip packaging structure, comprising a substrate, an adhesive, a chip, a lead, pins, epoxy resin, a circuit board and via holes, wherein the left and right side surfaces of the pins are fixedly provided with bumps; the total width of the bumps and the corresponding pin is slightly larger than the diameter of a corresponding via hole; the bottom surface of the epoxy resin is provided with a groove; a compression block is fixedly mounted in the groove; and a cavity is formed inside the epoxy resin and located above the chip. According to the peripheral integrated circuit chip packaging structure, when an external heat sink is connected, a heat dissipating plate is pressed down until the heat-dissipating plate is flush with the top surface of the epoxy resin, a spring is compressed, and heat is transferred to the heat sink through a heat conducting block and the heat dissipating plate heat for heat dissipation; when the external heat sink is not connected, the spring pushes the heat dissipating plate out of the top surface of the epoxy resin, and a heat dissipation area is increased through fins, so heat dissipation efficiency is improved.
Description
technical field [0001] The invention relates to the technical field of chip packaging, in particular to an integrated circuit chip packaging structure for peripheral devices. Background technique [0002] Chip packaging is a process of installing and sealing chips and related components. The packaging structure plays the role of placing, fixing, sealing and protecting chips. [0003] Common chip package structures such as figure 1 As shown, the substrate is bonded with a chip through an adhesive, and the top surface of the chip is connected to the pins through leads, and then the substrate and the chip are packaged with epoxy resin, and finally the pins are inserted into the circuit board for welding. When the chip is working Heat is generated, and its heat dissipation is gradually radiated to the inside of the epoxy resin through the chip, and then exchanges heat with the air through the surface of the epoxy resin, so the efficiency of heat dissipation is low, and because ...
Claims
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IPC IPC(8): H01L23/495H01L23/367
CPCH01L23/3672H01L23/49544H01L23/49548H01L23/49568H01L2224/48091H01L2224/48247H01L2924/181H01L2924/00014H01L2924/00012
Inventor 不公告发明人
Owner GUANGDONG GOPOD GRP HLDG CO LTD