Housing assembly, manufacturing method thereof, and electronic device
A shell assembly and manufacturing method technology, which is applied to the structural parts of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc., which can solve the problems of stuck electronic equipment, hot hands when holding electronic equipment, and decreased operating efficiency of electronic equipment, etc. problems, to achieve the effect of increasing the heat transfer area and avoiding excessive concentration
Active Publication Date: 2020-12-15
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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Problems solved by technology
Some current electronic devices will automatically take some measures to reduce power consumption after the temperature rises, which leads to a decrease in the operating efficiency of the electronic device, causing the electronic device to become stuck; at the same time, the user will feel hot when holding the electronic device
Method used
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[0019] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
[0020] With the rapid development of electronic devices (such as mobile terminals), the power consumption of the electronic devices is gradually increasing, and accordingly, the heat generated by the electronic devices during work is also relatively large. Taking the power supply as an example, the existing housing assembly is fixed on the middle frame of the power supply by glue. During the heat dissipation process, the heat generated by the power supply is transferred to the housing assemb...
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The embodiment of the invention provides a shell assembly, a preparation method thereof and electronic equipment. The shell assembly comprises a middle frame, a first metal layer, a second metal layer and a heat conducting medium, wherein the middle frame includes a middle plate, the middle plate includes an installation surface, the installation surface is provided with a groove, the middle plate further includes a bottom wall and a side wall which are located in the groove, and the side wall surrounds the bottom wall and is connected to the bottom wall. The first metal layer is injection moulded with the bottom wall. The second metal layer is arranged opposite to the first metal layer. A connecting part is connected between the first metal layer and the second metal layer, and the heat conducting medium is arranged in a medium cavity. The first metal layer is embedded in the middle plate, so that the thickness of the shell assembly or the electronic equipment is not additionally increased. When the shell assembly is used, the first metal layer and a heating element conduct heat correspondingly, and the heat is equalized on the whole shell assembly through the heat conducting medium so as to avoid excessive concentration of the heat in part of the electronic equipment. Meanwhile, the heat dissipation and heat transfer area of the electronic equipment can also be increased so as to dissipate out the heat as soon as possible.
Description
technical field [0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a shell assembly, a preparation method thereof, and electronic equipment. Background technique [0002] The power supply of electronic equipment or other electronic devices will generate a lot of heat during operation, which will increase the overall temperature of the electronic equipment. When the temperature rises sharply, there is a risk of spontaneous combustion. Some current electronic devices will automatically take some measures to reduce power consumption after the temperature rises, which leads to a decrease in the operating efficiency of the electronic device, causing the electronic device to become stuck; at the same time, the user will feel hot when holding the electronic device. Contents of the invention [0003] The purpose of the present application is to provide a shell assembly, its preparation method and electron...
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IPC IPC(8): H05K7/20
CPCH05K7/20336H05K7/20472
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD