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Chip picking assembly and chip moving method

A chip and assembly technology, applied in the field of chip picking, can solve problems such as chip consumption, cost reduction, and time-consuming

Active Publication Date: 2021-09-14
MPI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the number of chips is large, it will take a lot of time to pick up the chips one by one, which is not conducive to reducing costs.

Method used

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  • Chip picking assembly and chip moving method
  • Chip picking assembly and chip moving method
  • Chip picking assembly and chip moving method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0060] Please refer to Figure 1A , Figure 1B and Figure 1C , in this embodiment, the chip picking assembly 100 is suitable for cooperating with the transfer device 71 (such as a horizontal translation device, a rotating swing arm) and a suction nozzle 90 connected to the transfer device 71 to move a plurality of chips 60 on the film 50 at a time. one or several of . The film 50 and the chips 60 thereon are placed on a hollow stage (not shown). The chip picking assembly 100 includes a single first ejector pin 111 and a plurality of second ejector pins 112 . The first ejector pin 111 is adapted to be coupled to a displacement device 70 (eg, a vertical translation device) to move one of the chips 60 . The second ejector pins 112 are adapted to be coupled to another displacement device 70 to simultaneously move several of the chips 60 . The second ejector pins 112 are arranged in a matrix, such as a 2×2 matrix. In other embodiments, it may also be a matrix of 3x3, 5x5, 7x7...

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PUM

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Abstract

The invention provides a chip picking assembly and a chip moving method. The chip picking assembly is suitable for moving a plurality of chips arranged in a matrix on a film in cooperation with a transfer device and a suction nozzle connected to the transfer device. The chips are arranged according to a selected matrix. and attributes are divided into a plurality of matrix chip groups and a plurality of non-matrix chips, the arrangement of the chips belonging to one of the matrix chip groups conforms to a selected matrix, and the attributes of the chips belonging to one of the matrix chip groups belong to each other under the same test result range category. The chip picking assembly includes a single first thimble and multiple second thimbles. The first ejector pin is adapted to be coupled to the displacement device for one movement pertaining to one of the non-matrix chips. The second thimble is adapted to be coupled to the displacement device to simultaneously move the chips belonging to one of the matrix chip groups at a time, or to simultaneously move the chips belonging to one of the matrix chip groups at a time with the single first thimble. Both the chip picking assembly and the chip moving method can shorten the time for picking chips.

Description

technical field [0001] The invention relates to a chip picking technology, in particular to a chip picking assembly and a chip moving method for chip picking. Background technique [0002] In order to pick up the chips (for example, light-emitting diode chips) on the film, the chips are usually picked up by using a vacuum nozzle and a thimble. The function of the thimble is to deform the film to reduce the bonding area between the chip and the film, so that the vacuum nozzle can easily remove the chip from the film. During the chip picking process, the chips on the film are usually picked up one by one. However, when the number of chips is large, it will take a lot of time to pick up the chips one by one, which is not conducive to reducing the cost. Contents of the invention [0003] The present invention provides a chip picking assembly for moving one or more chips on a film at a time. [0004] The invention provides a chip moving method, which is used to move one or m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/687
CPCH01L21/67271H01L21/677H01L21/6875
Inventor 谢作宏刘长霖蔡振扬李建德
Owner MPI CORP