Wafer cleaning and drying device and method

Abstract

The invention relates to the technical field of wafer processing and particularly relates to a wafer cleaning and drying device and method. The wafer cleaning and drying device comprises a cavity, andat least two sets of main nozzle tubes disposed in the cavity. Each set of the main nozzle tubes comprises at least one cleaning tube for spraying cleaning liquid to the surface of a wafer, at leastone auxiliary drying tube for spraying auxiliary drying liquid, and at least one drying tube for spraying drying gas. The wafer sequentially passes through cleaning nozzles, auxiliary drying nozzles and drying nozzles of the wafer cleaning and drying device to be cleaned and dried, the cleaning and drying processes can be performed in one step, the wafer cleaning and drying efficiency can be improved, the processing time is reduced, materials are saved, energies are saved, and the emission is reduced.

Description

technical field [0001] The present application relates to the technical field of wafer processing, in particular to a wafer cleaning and drying device and method. Background technique [0002] In the manufacture of integrated circuits, wafers require multiple fabrication processes. After many processes are completed, such as wet etching, etc., pollutants are usually left on the surface of the wafer. These pollutants have a great impact on the subsequent process of the product. Therefore, the wafer must be cleaned and dried before the wafer can enter the next stage. In one manufacturing process, the effect of wafer cleaning and drying directly affects the yield of products. [0003] figure 1 It is a structural schematic diagram of a wafer cleaning and drying device and a schematic diagram of wafer cleaning and drying technical steps using the device. refer to figure 1 (a), the wafer cleaning and drying device includes a cleaning tank 110, which is arranged in the cavity o...

AI Technical Summary

Problems solved by technology

[0005] The wafer cleaning and drying device is used to clean and dry the wafer. The cleaning and drying are completed step by step, which takes a long time, consumes a lot of water and cleaning liquid, has low cleaning efficiency, and high cleaning cost; With the increase of the etching aspect ratio of the wet etching process in the semiconductor process, it is difficult for the cleaning and drying equipment to clean and dry the deep grooves on the surface of the wafer thoroughly; in addition, when the wafer loading device pulls the wafer at a speed When the control is not good, serious water marks will be formed on the bottom of the wafer, which will affect the product yield

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